公开(公告)号：US20220214728A1

公开(公告)日：2022-07-07

申请号：US17142658

申请日：2021-01-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Eric MARZ ,  Kirk D. PETERSON ,  Greg ABRAMI ,  Howard V. MAHANEY, Jr. ,  William James ANDERL ,  Eric Jason FLUHR ,  Todd Jon ROSEDAHL

IPC: G06F1/20 ,  G05B17/02

Abstract: Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.