公开(公告)号：US08975531B2

公开(公告)日：2015-03-10

申请号：US13746627

申请日：2013-01-22

Applicant: International Business Machines Corporation

Inventor： Felix Anderson ,  Zhong-Xiang He ,  Anthony K. Stamper

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/11 ,  H01L21/76847 ,  H01L21/76877 ,  H01L23/5283 ,  H01L23/53238 ,  H01L2924/0002 ,  H05K3/40 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Various embodiments include interconnect structures and methods of forming such structures. The interconnect structures can include a composite copper wire which includes at least two distinct copper sections. The uppermost copper section can have a thickness of approximately 1 micrometer or less, which inhibits surface roughening in that uppermost section, and helps to enhance cap adhesion with overlying layers.

Abstract translation: 各种实施例包括形成这种结构的互连结构和方法。 互连结构可以包括复合铜线，其包括至少两个不同的铜部分。 最上面的铜部分可以具有大约1微米或更小的厚度，这抑制了在最上面的部分的表面粗糙化，并且有助于增强与上覆层的盖子粘附。

公开(公告)号：US20140202746A1

公开(公告)日：2014-07-24

申请号：US13746627

申请日：2013-01-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Felix Anderson ,  Zhong-Xiang He ,  Anthony K. Stamper

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/11 ,  H01L21/76847 ,  H01L21/76877 ,  H01L23/5283 ,  H01L23/53238 ,  H01L2924/0002 ,  H05K3/40 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Various embodiments include interconnect structures and methods of forming such structures. The interconnect structures can include a composite copper wire which includes at least two distinct copper sections. The uppermost copper section can have a thickness of approximately 1 micrometer or less, which inhibits surface roughening in that uppermost section, and helps to enhance cap adhesion with overlying layers.

Abstract translation: 各种实施例包括形成这种结构的互连结构和方法。 互连结构可以包括复合铜线，其包括至少两个不同的铜部分。 最上面的铜部分可以具有大约1微米或更小的厚度，这抑制了在最上面的部分的表面粗糙化，并且有助于增强与上覆层的盖子粘附。