公开(公告)号：US20140247555A1

公开(公告)日：2014-09-04

申请号：US13782357

申请日：2013-03-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Tan D. DOAN ,  Michael J. ELLSWORTH, JR. ,  Randall G. Kemink ,  Eric J. McKEEVER

IPC: H05K7/20 ,  B23P15/26 ,  F28F1/00

CPC classification number: H05K7/20254 ,  B23P15/26 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/4935 ,  H01L2924/00

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.

Abstract translation: 提供了冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到可操作地插入到电子系统中的电子卡的热转印结构。 热传递结构包括可在打开位置和夹紧位置之间移动的夹紧结构。 与电子系统可操作地插入的电子系统相关联的冷却剂冷却结构驻留在电子卡之间，并且至少部分地通过将电子卡插入电子系统中的夹持结构。 夹紧结构的打开位置便于电子系统内的电子卡与卡之间的冷却剂冷却结构与至少部分地夹持结构之间的卡止结构，并且夹紧结构向夹紧位置的移动有利于夹紧 冷却剂冷却结构的热传递结构以及从卡到冷却剂冷却结构的热传导。

公开(公告)号：US20150053388A1

公开(公告)日：2015-02-26

申请号：US14528083

申请日：2014-10-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Randall G. KEMINK ,  Eric J. McKEEVER

IPC: F28F1/12 ,  H05K7/20 ,  B23P15/26

CPC classification number: F28F1/12 ,  B23P15/26 ,  F28F1/00 ,  H05K7/20763 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Methods of fabricating cooling apparatuses are provided, which include providing a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Abstract translation: 提供了制造冷却装置的方法，其包括提供被配置为耦合和冷却一个或多个电子部件的热传递结构。 热传递结构包括散热器和耦合到散热器的至少一个冷却剂供给管。 冷却剂输送管包括基本上设置在公共平面中的多个管长度和外平面管弯曲。 平面外弯管耦合在多个管长度的第一和第二管段的流体连通中，并且从设置在公共平面中的多个管段延伸出来。 第一和第二管长度可以间隔开，第三管长度设置在它们之间，并且冷却剂输送管还包括平面内的管弯曲部，其将流体连通第三管长度和第四管 多管长度。

公开(公告)号：US20140246174A1

公开(公告)日：2014-09-04

申请号：US13782384

申请日：2013-03-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Eric J. McKEEVER

IPC: F28F1/00 ,  B23P15/26

CPC classification number: F28F1/12 ,  B23P15/26 ,  F28F1/00 ,  H05K7/20763 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Abstract translation: 提供冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到并冷却一个或多个电子部件的热传递结构。 热传递结构包括散热器和耦合到散热器的至少一个冷却剂供给管。 冷却剂输送管包括基本上设置在公共平面中的多个管长度和外平面管弯曲。 平面外弯管耦合在多个管长度的第一和第二管段的流体连通中，并且从设置在公共平面中的多个管段延伸出来。 第一和第二管长度可以间隔开，第三管长度设置在它们之间，并且冷却剂输送管还包括平面内的管弯曲部，其将流体连通第三管长度和第四管 多管长度。

公开(公告)号：US20150359140A1

公开(公告)日：2015-12-10

申请号：US14827699

申请日：2015-08-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Tan D. DOAN ,  Michael J. ELLSWORTH, JR. ,  Randall G. KEMINK ,  Eric J. McKEEVER

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  B23P15/26 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/4935 ,  H01L2924/00

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.

Abstract translation: 提供了冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到可操作地插入到电子系统中的电子卡的热转印结构。 热传递结构包括可在打开位置和夹紧位置之间移动的夹紧结构。 与电子系统可操作地插入的电子系统相关联的冷却剂冷却结构驻留在电子卡之间，并且至少部分地通过将电子卡插入电子系统中的夹持结构。 夹紧结构的打开位置便于电子系统内的电子卡与卡之间的冷却剂冷却结构与至少部分地夹持结构之间的卡止结构，并且夹紧结构向夹紧位置的移动有利于夹紧 冷却剂冷却结构的热传递结构以及从卡到冷却剂冷却结构的热传导。

公开(公告)号：US20150052753A1

公开(公告)日：2015-02-26

申请号：US14528052

申请日：2014-10-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Tan D. DOAN ,  Michael J. ELLSWORTH, Jr. ,  Randall G. KEMINK ,  Eric J. McKEEVER

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20254 ,  B23P15/26 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/4935 ,  H01L2924/00

Abstract: Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.

Abstract translation: 提供了制造冷却装置的方法，其包括：提供构造成耦合到电子卡的热转印结构，所述热转印结构包括可在打开位置和夹紧位置之间移动的夹持结构; 以及提供冷却剂冷却结构，其被配置为驻留在所述电子系统的接收槽内并且与所述电子系统的接收槽相关联，所述电子系统在所述电子系统中可操作地插入所述冷却剂冷却结构，所述冷却剂冷却结构驻留在所述电子卡之间， 当传输结构耦合到电子卡并且卡可操作地插入到接收槽中时，结构，其中打开的位置有助于将电子卡插入到电子系统中，并且夹持结构移动到夹紧位置有助于夹紧 冷却剂冷却结构的热传递结构，以及从电子卡到冷却剂冷却结构的热传导。