公开(公告)号：US11019755B2

公开(公告)日：2021-05-25

申请号：US16749134

申请日：2020-01-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: G05D23/00 ,  H05K7/20 ,  G05D23/19 ,  G05B15/02

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

公开(公告)号：US20160153595A1

公开(公告)日：2016-06-02

申请号：US14824559

申请日：2015-08-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Michael J. ELLSWORTH, Jr. ,  Eric J. McKEEVER

IPC: F16L25/14 ,  F16L21/00

CPC classification number: F16L21/002 ,  F16L25/14 ,  F16L55/027 ,  H05K7/20272 ,  H05K7/20772

Abstract: Tapering couplers and coupling methods for connecting fluid flow components are provided. In one embodiment, the tapering coupler includes a housing with a first opening and a second opening in fluid communication through the housing. The first opening is sized for a first fluid flow component to couple to the housing, and the second opening for a second fluid flow component. The first and second fluid flow components include first and second fluid-carrying channels of different diameter, with the first fluid-carrying channel having a first channel diameter that is larger than the second channel diameter of the second fluid-carrying channel. A tapering element is associated with the housing and extends into the first fluid-carrying channel. The tapering element includes a tapering fluid-carrying channel which tapers in a direction back towards the housing, for instance, from about the first channel diameter to about the second channel diameter.

Abstract translation: 提供锥形耦合器和用于连接流体流动部件的联接方法。 在一个实施例中，锥形联接器包括具有第一开口的壳体和通过壳体流体连通的第二开口。 第一开口的尺寸用于第一流体流动分量以耦合到壳体，第二开口用于第二流体流动分量。 第一和第二流体流动部件包括不同直径的第一和第二流体输送通道，其中第一流体承载通道具有大于第二流体输送通道的第二通道直径的第一通道直径。 锥形元件与壳体相关联并且延伸到第一流体承载通道中。 锥形元件包括锥形流体承载通道，其沿着朝向壳体的方向逐渐变细，例如从大约第一通道直径到约第二通道直径。

公开(公告)号：US20150052753A1

公开(公告)日：2015-02-26

申请号：US14528052

申请日：2014-10-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Tan D. DOAN ,  Michael J. ELLSWORTH, Jr. ,  Randall G. KEMINK ,  Eric J. McKEEVER

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20254 ,  B23P15/26 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/4935 ,  H01L2924/00

Abstract: Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.

Abstract translation: 提供了制造冷却装置的方法，其包括：提供构造成耦合到电子卡的热转印结构，所述热转印结构包括可在打开位置和夹紧位置之间移动的夹持结构; 以及提供冷却剂冷却结构，其被配置为驻留在所述电子系统的接收槽内并且与所述电子系统的接收槽相关联，所述电子系统在所述电子系统中可操作地插入所述冷却剂冷却结构，所述冷却剂冷却结构驻留在所述电子卡之间， 当传输结构耦合到电子卡并且卡可操作地插入到接收槽中时，结构，其中打开的位置有助于将电子卡插入到电子系统中，并且夹持结构移动到夹紧位置有助于夹紧 冷却剂冷却结构的热传递结构，以及从电子卡到冷却剂冷却结构的热传导。

公开(公告)号：US20130180686A1

公开(公告)日：2013-07-18

申请号：US13785275

申请日：2013-03-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: F28D15/00

CPC classification number: F28D15/00 ,  G05D16/202

Abstract: A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop. More particularly, the pressure threshold is set to ensure pressure of system coolant within the coolant loop remains above the coolant's saturation pressure at maximum operational temperature.

Abstract translation: 提供了一种压力控制单元和方法，用于促进在液体冷却系统内的单相热传递。 压力控制单元包括容纳系统冷却剂的压力容器和与压力容器相关联的加压机构。 冷却剂管线将压力容器中的系统冷却剂与冷却系统的冷却剂回路流体连通，并且调节器机构联接到加压机构，以将压力容器内的压力维持在或高于限定的压力阈值，从而保持在 冷却剂回路高于压力阈值。 设定的压力阈值被设定为便于在冷却剂回路内的系统冷却剂的整个工作温度范围内，冷却剂回路内的系统冷却剂保持单相。 更具体地，设定压力阈值以确保冷却剂回路内的系统冷却剂的压力在最大工作温度下保持高于冷却剂的饱和压力。

公开(公告)号：US20160143189A1

公开(公告)日：2016-05-19

申请号：US14546136

申请日：2014-11-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, Jr. ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20 ,  B29C70/84 ,  B29C70/88

CPC classification number: H01L23/473 ,  B29C43/18 ,  B29C43/203 ,  B29C70/84 ,  B29C70/88 ,  B29K2101/12 ,  B29K2705/00 ,  B29L2009/00 ,  B29L2031/3406 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20436 ,  H05K7/20509 ,  H05K7/20772

Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Abstract translation: 提供了复合散热器结构和制造方法，其中复合散热器结构包括：导热基底，其具有主要传热表面以耦合到例如要冷却的至少一个电子部件; 可压缩，连续的密封构件; 以及密封构件保持器，压缩可压缩连续的密封构件抵靠导热基座; 和原位模制件。 将原位模制构件模制在导热基底上并固定到导热基底上，并将其模制并固定到密封构件保持器的适当位置。 在导热基座和原位模制构件之间设有冷却剂携带室，并且冷却剂入口和出口设置成与冷却剂携带室流体连通，以便液体冷却剂流过室。

公开(公告)号：US20150173251A1

公开(公告)日：2015-06-18

申请号：US14132230

申请日：2013-12-18

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20218 ,  H05K7/2039 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其促进从电子部件的热传递。 冷却装置包括具有导热结构的液冷式散热器，该导热结构具有包括减小横截面冷却剂流动面积的区域的冷却剂输送室。 散热器包括与隔室流体连通的冷却剂入口和出口，并且减小的横截面冷却剂流动区域的区域提供了导电结构的主传热表面与冷却剂之间增加的有效传热系数。 冷却装置还包括联接到冷却剂入口和出口的冷却剂回路，以便于冷却剂流过冷却剂携带室，以及冷却剂过滤器，其被定位成过滤来自穿过散热器的冷却剂的污染物。 冷却剂过滤器具有比截面冷却剂流动面积减小的区域更大的横截面冷却剂流动面积。

公开(公告)号：US20150047809A1

公开(公告)日：2015-02-19

申请号：US14528066

申请日：2014-10-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, Jr. ,  Eric J. McKEEVER ,  Richard P. SNIDER

IPC: F28F9/26

CPC classification number: H05K7/20254 ,  F16L41/10 ,  F28D15/0275 ,  F28F9/02 ,  Y10T29/4935

Abstract: Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.

Abstract translation: 提供制造冷却装置和冷却剂冷却的电子组件的方法，其包括提供热传递结构，其被配置为耦合到具有一个或多个要冷却的电子部件的电子卡的一侧或多侧。 热传递结构包括散热器和与散热器相关联的至少一个冷却剂传送通道，以便于将热量从散热器移除到流过冷却剂传送通道的冷却剂。 该方法还包括提供与电子系统的插座相邻设置的冷却剂歧管结构，其中电子卡片可操作地对接，并且提供流体和机械附接机构，其有助于热传递结构和冷却剂的选择性，流体和机械耦合或解耦 歧管结构，该附接机构有助于冷却剂流在冷却剂歧管结构和热传递结构的冷却剂传送通道之间。

公开(公告)号：US20140307389A1

公开(公告)日：2014-10-16

申请号：US13862710

申请日：2013-04-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, Jr. ,  Eric J. McKEEVER

IPC: H05K7/20

CPC classification number: H05K7/20281 ,  B21D53/04 ,  F28D15/00 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/4935 ,  Y10T29/49359 ,  H01L2924/00

Abstract: Cooling apparatuses and methods of fabrication thereof are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

Abstract translation: 提供冷却装置及其制造方法，其有助于冷却诸如轮毂模块组件的多部件组件。 冷却装置包括：第一液冷式散热器，其构造成便于去除由多组分组件的一个或多个第一电子部件产生的热;以及第二液冷散热器，其被配置为便于去除由一个或多个 多组件组件的更多第二电子部件。 第一液冷散热器可分离地联接到多组件组件，并且第二液冷散热器固定地固定到多组件组件。 流体耦合器流体耦合第一和第二液冷散热器，以便于液体冷却剂从可分离耦合的第一液冷散热器流过固定固定的第二液冷散热器。

公开(公告)号：US20170013746A1

公开(公告)日：2017-01-12

申请号：US14791681

申请日：2015-07-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, Jr. ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20736 ,  H05K7/20836

Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

公开(公告)号：US20140254098A1

公开(公告)日：2014-09-11

申请号：US13790241

申请日：2013-03-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, Jr. ,  Eric J. McKEEVER

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  F28D15/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20281 ,  H01L2924/00

Abstract: A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

Abstract translation: 提供冷却剂冷却的电子模块，其包括多组件组件和具有在各个电子部件上对齐的开口的模块盖。 导热元件设置在开口内，每个包括相对的冷却剂冷却和传导表面，导电表面热耦合到相应的电子部件。 设置在模块盖上方的歧管组件包括内部和外部歧管元件，内部元件构造成便于冷却剂流入冷却剂冷却表面。 外部歧管元件设置在内部歧管元件上并且联接到模块盖，其中内部和外部歧管元件限定冷却剂供应歧管，并且外部歧管元件和模块盖限定冷却剂返回歧管。 冷却剂供应开口与冷却剂供应歧管流体连通，并且冷却剂排放通道与冷却剂回流歧管流体连通。