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公开(公告)号：US20180368285A1
公开(公告)日：2018-12-20
申请号：US16111359
申请日：2018-08-24
IPC分类号： H05K7/20 , F16L37/107 , F16L15/08
摘要： Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.
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2.发明申请FABRICATING SEPARABLE AND INTEGRATED HEAT SINKS FACILITATING COOLING MULTI-COMPONENT ELECTRONIC ASSEMBLY 有权制造可分离和集成的散热器加热冷却多组分电子组件公开(公告)号：US20150075755A1
公开(公告)日：2015-03-19
申请号：US14551464
申请日：2014-11-24
CPC分类号： H05K7/20281 , B21D53/04 , F28D15/00 , H01L23/473 , H01L2924/0002 , H05K7/20772 , Y10T29/4935 , Y10T29/49359 , H01L2924/00
摘要： Methods of fabricating cooling apparatus are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.
摘要翻译： 提供制造冷却装置的方法，其有助于冷却诸如轮毂模块组件的多组件组件。 冷却装置包括：第一液冷式散热器，其构造成便于去除由多组分组件的一个或多个第一电子部件产生的热;以及第二液冷散热器，其被配置为便于去除由一个或多个 多组件组件的更多第二电子部件。 第一液冷散热器可分离地联接到多组件组件，并且第二液冷散热器固定地固定到多组件组件。 流体耦合器流体耦合第一和第二液冷散热器，以便于液体冷却剂从可分离耦合的第一液冷散热器流过固定固定的第二液冷散热器。
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公开(公告)号：US20180368286A1
公开(公告)日：2018-12-20
申请号：US16111375
申请日：2018-08-24
IPC分类号： H05K7/20 , F16L37/107 , F16L15/08
摘要： Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.
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公开(公告)号：US20160341342A1
公开(公告)日：2016-11-24
申请号：US14846905
申请日：2015-09-07
CPC分类号： H05K7/20627 , F16L15/08 , F16L37/107 , H05K7/20272 , H05K7/20772
摘要： Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.
摘要翻译： 提供了用于连接流体承载部件的联接组件。 联接组件包括例如：具有第一开口的插座和通过配件流体连通的第二开口，第一开口的尺寸适于容纳第一流体承载部件，并且第二开口的尺寸适于容纳第二开口 流体携带部件; 套筒，所述套筒环绕所述插座配件并且可相对于所述配件旋转，并且所述套筒包括第一锁定特征; 以及与所述流体承载部件之一相关联的第二锁定特征。 当一个流体承载部件插入到插座配件中时，第二锁定特征被定位和定尺寸成接合套筒的第一锁定特征。 一旦接合，套筒的旋转将第一和第二锁定特征锁定在一起以将一个流体承载部件固定到插座配件上。
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5.发明申请公开(公告)号：US20140238640A1
公开(公告)日：2014-08-28
申请号：US13778524
申请日：2013-02-27
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER , Richard P. SNIDER
IPC分类号： F28F9/26
CPC分类号： H05K7/20254 , F16L41/10 , F28D15/0275 , F28F9/02 , Y10T29/4935
摘要： Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.
摘要翻译： 提供冷却装置和冷却剂冷却的电子组件，其包括热传递结构，其被配置为耦合到具有一个或多个要冷却的电子部件的电子卡的一侧或多侧。 热传递结构包括散热器和与散热器相关联的至少一个冷却剂传送通道，以便于将热量从散热器移除到流过冷却剂传送通道的冷却剂。 冷却装置还包括冷却剂歧管结构，该冷却剂歧管结构设置在电子系统的插座附近，电子系统的插座在其中可操作地对接，以及流体和机械附接机构，其有助于热传递结构和冷却剂歧管的选择性，流体和机械耦合或解耦 结构，该附接机构有助于冷却剂流在冷却剂歧管结构和热传递结构的冷却剂传送通道之间。
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公开(公告)号：US20160345466A1
公开(公告)日：2016-11-24
申请号：US14717009
申请日：2015-05-20
CPC分类号： H05K7/20627 , F16L15/08 , F16L37/107 , H05K7/20272 , H05K7/20772
摘要： Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.
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7.发明申请FABRICATING THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FOR COOLING ELECTRONICS CARD(S) 有权制造电子卡的热转印和冷却冷却结构（S）公开(公告)号：US20150052754A1
公开(公告)日：2015-02-26
申请号：US14528075
申请日：2014-10-30
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER , Richard P. SNIDER
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20636 , H05K7/20772 , Y10T29/4935
摘要： Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).
摘要翻译： 提供了制造冷却装置和冷却剂冷却的电子组件的方法，其包括：将构造成具有一个或多个要冷却的电子部件的电子卡的一侧或多侧的热传递结构联接在一起，所述热传递结构包括耦合 到电子卡的一边; 并且将冷却剂冷却结构设置在电子系统的插座附近，冷却剂冷却结构包括一个或多个低剖面冷轨，其大小和构造成沿着热扩散器的底部边缘热耦合到散热器，其操作 电子卡在插座内的对接，以及与低剖面冷轨相关联的一个或多个冷却剂传送通道，用于将热量从低剖面冷轨移除到流过冷却剂承载通道的冷却剂 （s）。
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公开(公告)号：US20140254098A1
公开(公告)日：2014-09-11
申请号：US13790241
申请日：2013-03-08
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , F28D15/00 , G06F1/20 , H01L21/4882 , H01L23/34 , H01L23/367 , H01L23/3675 , H01L23/3677 , H01L23/473 , H01L2924/0002 , H05K7/20281 , H01L2924/00
摘要： A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.
摘要翻译： 提供冷却剂冷却的电子模块，其包括多组件组件和具有在各个电子部件上对齐的开口的模块盖。 导热元件设置在开口内，每个包括相对的冷却剂冷却和传导表面，导电表面热耦合到相应的电子部件。 设置在模块盖上方的歧管组件包括内部和外部歧管元件，内部元件构造成便于冷却剂流入冷却剂冷却表面。 外部歧管元件设置在内部歧管元件上并且联接到模块盖，其中内部和外部歧管元件限定冷却剂供应歧管，并且外部歧管元件和模块盖限定冷却剂返回歧管。 冷却剂供应开口与冷却剂供应歧管流体连通，并且冷却剂排放通道与冷却剂回流歧管流体连通。
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公开(公告)号：US20140247555A1
公开(公告)日：2014-09-04
申请号：US13782357
申请日：2013-03-01
发明人： Amilcar R. ARVELO , Mark A. BRANDON , Levi A. CAMPBELL , Tan D. DOAN , Michael J. ELLSWORTH, JR. , Randall G. Kemink , Eric J. McKEEVER
CPC分类号： H05K7/20254 , B23P15/26 , G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , Y10T29/4935 , H01L2924/00
摘要： Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.
摘要翻译： 提供了冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到可操作地插入到电子系统中的电子卡的热转印结构。 热传递结构包括可在打开位置和夹紧位置之间移动的夹紧结构。 与电子系统可操作地插入的电子系统相关联的冷却剂冷却结构驻留在电子卡之间，并且至少部分地通过将电子卡插入电子系统中的夹持结构。 夹紧结构的打开位置便于电子系统内的电子卡与卡之间的冷却剂冷却结构与至少部分地夹持结构之间的卡止结构，并且夹紧结构向夹紧位置的移动有利于夹紧 冷却剂冷却结构的热传递结构以及从卡到冷却剂冷却结构的热传导。
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公开(公告)号：US20160363243A1
公开(公告)日：2016-12-15
申请号：US14482147
申请日：2014-09-10
摘要： Tapering couplers and coupling methods for connecting fluid flow components are provided. In one embodiment, the tapering coupler includes a housing with a first opening and a second opening in fluid communication through the housing. The first opening is sized for a first fluid flow component to couple to the housing, and the second opening for a second fluid flow component. The first and second fluid flow components include first and second fluid-carrying channels of different diameter, with the first fluid-carrying channel having a first channel diameter that is larger than the second channel diameter of the second fluid-carrying channel. A tapering element is associated with the housing and extends into the first fluid-carrying channel. The tapering element includes a tapering fluid-carrying channel which tapers in a direction back towards the housing, for instance, from about the first channel diameter to about the second channel diameter.
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