公开(公告)号：US20140184258A1

公开(公告)日：2014-07-03

申请号：US13733507

申请日：2013-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hanyi DING ,  John FERRARIO ,  Barton E. GREEN ,  Stephen MOSS ,  Mustapha SLAMANI

IPC: G01R1/067 ,  G01R31/26

CPC classification number: G01R31/26 ,  G01R1/06766 ,  G01R1/06772

Abstract: Approaches for performing in line wafer testing are provided. An approach includes a method that includes generating a radio frequency (RF) test signal, and applying the RF test signal to a device under test (DUT) in a wafer using a buckling beam probe set with a predefined pitch. The method also includes detecting an output RF signal from the DUT in response to the applying the RF test signal to the DUT, and sensing at least one frequency component of the detected output RF signal.

Abstract translation: 提供了执行在线晶片测试的方法。 一种方法包括一种方法，其包括产生射频（RF）测试信号，以及使用具有预定间距的屈曲束探针将RF测试信号施加到晶片中的待测器件（DUT）。 该方法还包括响应于将RF测试信号施加到DUT并且检测检测到的输出RF信号的至少一个频率分量来检测来自DUT的输出RF信号。