公开(公告)号：US20150106780A1

公开(公告)日：2015-04-16

申请号：US14551693

申请日：2014-11-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jeanne P. BICKFORD ,  Nazmul HABIB ,  Baozhen LI ,  Pascal A. NSAME

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F17/5009 ,  G06F2217/10

Abstract: Systems and methods for semiconductor device reliability qualification during semiconductor device design. A method is provided that includes defining performance process window bins for a performance window. The method further includes determining at least one failure mechanism for each bin assignment. The method further includes generating different reliability models when the at least one failure mechanism is a function of the process window, and generating common reliability models when the at least one failure mechanism is not the function of the process window. The method further includes identifying at least one risk factor for each bin assignment, and generating aggregate models using a manufacturing line distribution. The method further includes determining a fail rate by bin and optimizing a line center to minimize product fail rate. The method further includes determining a fail rate by bin and scrapping production as a function of a manufacturing line excursion event.

Abstract translation: 半导体器件设计期间半导体器件可靠性鉴定的系统和方法。 提供了一种方法，其中包括为性能窗口定义性能过程窗口。 该方法还包括确定每个仓分配的至少一个故障机制。 所述方法还包括当所述至少一个故障机制是所述过程窗口的函数时产生不同的可靠性模型，以及当所述至少一个故障机制不是所述过程窗口的功能时，生成公共可靠性模型。 该方法还包括识别用于每个仓分配的至少一个风险因素，以及使用生产线分布生成聚合模型。 该方法还包括通过bin确定故障率并优化线路中心以最小化产品故障率。 该方法还包括根据制造线偏移事件来确定废料箱的故障率和报废产量。

公开(公告)号：US20140380261A1

公开(公告)日：2014-12-25

申请号：US13922311

申请日：2013-06-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jeanne P. BICKFORD ,  Nazmul HABIB ,  Baozhen LI ,  Pascal A. NSAME

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F17/5009 ,  G06F2217/10

Abstract: Systems and methods for semiconductor device reliability qualification during semiconductor device design. A method is provided that includes defining performance process window bins for a performance window. The method further includes determining at least one failure mechanism for each bin assignment. The method further includes generating different reliability models when the at least one failure mechanism is a function of the process window, and generating common reliability models when the at least one failure mechanism is not the function of the process window. The method further includes identifying at least one risk factor for each bin assignment, and generating aggregate models using a manufacturing line distribution. The method further includes determining a fail rate by bin and optimizing a line center to minimize product fail rate. The method further includes determining a fail rate by bin and scrapping production as a function of a manufacturing line excursion event.

Abstract translation: 半导体器件设计期间半导体器件可靠性鉴定的系统和方法。 提供了一种方法，其中包括为性能窗口定义性能过程窗口。 该方法还包括确定每个仓分配的至少一个故障机制。 所述方法还包括当所述至少一个故障机制是所述过程窗口的函数时产生不同的可靠性模型，以及当所述至少一个故障机制不是所述过程窗口的功能时，生成公共可靠性模型。 该方法还包括识别用于每个仓分配的至少一个风险因素，以及使用生产线分布生成聚合模型。 该方法还包括通过bin确定故障率并优化线路中心以最小化产品故障率。 该方法还包括根据制造线偏移事件来确定废料箱的故障率和报废产量。