公开(公告)号：US20160161545A1

公开(公告)日：2016-06-09

申请号：US14561830

申请日：2014-12-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jeffrey P. GAMBINO ,  Eric D. JOHNSON ,  Ian A. MCCALLUM-COOK ,  Richard A. PHELPS ,  Anthony K. STAMPER ,  Michael J. ZIERAK

IPC: G01R31/26 ,  H01L29/10 ,  H01L29/06

CPC classification number: G01R31/2601 ,  H01L21/26513 ,  H01L22/34 ,  H01L29/0626

Abstract: A high resistivity substrate final resistance test structure, methods of manufacture and testing processes are disclosed. The test structure includes spaced apart implants extending into a high resistivity wafer in at least one kerf region of the wafer. The test structure further includes contacts in direct electrical contact to each of the spaced apart implants.

Abstract translation: 公开了一种高电阻率基板最终电阻测试结构，制造和测试方法。 测试结构包括在晶片的至少一个切痕区域中延伸到高电阻率晶片的间隔开的植入物。 测试结构还包括与每个间隔开的植入物直接电接触的触点。