公开(公告)号：US20020035782A1

公开(公告)日：2002-03-28

申请号：US09956147

申请日：2001-09-20

申请人： ISHII TOOL & ENGINEERING CORPORATION

发明人： Mitoshi Ishii

IPC分类号： H05K003/30 ,  B23P019/00

CPC分类号： H01L21/67092 ,  B24D5/12 ,  B28D1/121 ,  B28D5/023 ,  H05K3/0052 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/5193 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53196

摘要： The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed nullinto the second cutting device 33null by the second conveying device 43 along the direction of length. nullThe cut wiring boards 3anull are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

摘要翻译： 本发明的目的是通过使用单个装置来切割安装有多个IC芯片的布线板来形成单独的封装IC。 第一切割装置23将布线板3沿着一个方向切割成分离的部分，使得切割的布线板3构成条形切割布线板3a。 切割的线路板3a被输送到第二切割装置33，并且通过第二输送装置43沿着长度方向进给到第二切割装置33。 [切割线路板3a]然后被相对于第一切割方向改变了90度的方向被第二切割装置33切割。 由第二切割装置33进行的切割而产生的布线板3b构成IC封装的原始形式。 已经从第二切割装置33切割和输送的布线板3b进入清洁步骤。