公开(公告)号：US20150230345A1

公开(公告)日：2015-08-13

申请号：US14695216

申请日：2015-04-24

申请人： Texas Instruments Incorporated

发明人： Allan Jerome Daen Rapales ,  Floro Lopez Camenforte, III ,  John Paul Quianzon Kwo

IPC分类号： H05K3/34 ,  H05K3/00 ,  H05K3/30 ,  H01G2/06

CPC分类号： H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/301 ,  H05K3/3452 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/046 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/43 ,  Y10T29/49135

摘要： A method of registering terminals on an interdigitated chip capacitor (“IDC”) with a plurality of contact pads on a substrate. At least one vertically extending nonconductive abutment surface is formed between adjacent ones of the contact pads. A plurality of grooves projecting outwardly from said a central recess is formed on the substrate top portion. At least one sidewall portion of the IDC is urged into abutting engagement with the at least one abutment surface on the substrate. Another method prevent solder from causing short circuits between adjacent terminals. A plurality of grooves extending laterally outwardly from a central recessed portion are formed. The plurality of grooves defining a plurality of inwardly projecting fingers. A plurality of contact pads on are formed on a respective plurality of fingers. A solder bead is formed on at least some of the plurality of contact pads. The at least one solder bead is isolated from adjacent solder beads and adjacent terminals.

摘要翻译： 一种在叉指片式电容器（“IDC”）上的端子与衬底上的多个接触焊盘对准的方法。 在相邻的接触垫之间形成至少一个垂直延伸的非导电邻接表面。 在所述基板顶部形成有从所述中心凹部向外突出的多个凹槽。 IDC的至少一个侧壁部分被推动成与基底上的至少一个邻接表面邻接接合。 另一种方法可以防止焊料在相邻端子之间引起短路。 形成从中心凹部横向向外延伸的多个槽。 多个槽限定多个向内突出的指状物。 在多个指状物上形成多个接触垫。 在多个接触垫中的至少一些上形成焊珠。 至少一个焊珠与相邻的焊球和相邻的端子隔离。

公开(公告)号：US20150173207A1

公开(公告)日：2015-06-18

申请号：US14631192

申请日：2015-02-25

申请人： Lexmark International, Inc.

发明人： Keith Bryan Hardin ,  Paul Kevin Hall ,  Qing Zhang ,  John Thomas Fessler

IPC分类号： H05K3/30

CPC分类号： H05K3/301 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10893 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

摘要： A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

摘要翻译： 根据一个示例的用于形成用于插入到印刷电路板的安装孔中的Z定向部件的方法包括用主体材料填充具有锥形表面的第一腔体。 约束材料的第一层设置在第一空腔的顶部上，并具有第二腔，其宽度小于第一空腔。 第二个空腔充满了主体材料。 约束材料的连续层设置在约束材料的第一层的顶部上。 约束材料的连续层的空腔至少选择性填充主体材料，以形成Z向分量的主体部分的层。 消融约束材料以将约束材料释放Z定向的成分，并且对Z指向的元件进行烧制。

公开(公告)号：US20150022062A1

公开(公告)日：2015-01-22

申请号：US14508458

申请日：2014-10-07

申请人： PIEDEK TECHNICAL LABORATORY

发明人： Hirofumi KAWASHIMA

IPC分类号： H03H9/21 ,  H03B5/32

CPC分类号： H03H9/21 ,  H01L41/04 ,  H01L41/22 ,  H03B5/32 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/1021 ,  H03H9/215 ,  H03H2003/026 ,  H03H2003/0492 ,  H04R17/00 ,  H04R31/00 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4908 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49135

摘要： In a quartz crystal unit, the unit comprising a case, a quartz crystal tuning fork resonator and a lid, the resonator having a tuning fork base, and first and second tuning fork tines, each of the first and second tuning fork tines having a first side surface and a second side surface opposite the first side surface, the first side surface of the first tuning fork tine confronting the second side surface of the second tuning fork tine; at least one groove having a plurality of surfaces including a first surface being formed in at least one of first and second main surfaces of each of the first and second tuning fork tines so that only the first surface of the at least one groove is directly opposite the first side surface of the corresponding tuning fork tine and a width of the at least one groove is greater than or equal to a distance in the width direction of the at least one groove measured from an outer edge of the at least one groove to an outer edge of the corresponding one of the first and second tuning fork tines and less than 0.07 mm.

摘要翻译： 在石英晶体单元中，所述单元包括壳体，石英音叉谐振器和盖子，所述谐振器具有音叉基座，以及第一和第二音叉尖齿，所述第一和第二音叉尖端中的每一个具有第一 与第一侧面相对的第二侧面，与第二音叉齿的第二侧面相对的第一音叉尖的第一侧面; 具有多个表面的至少一个凹槽包括第一表面，所述第一表面形成在所述第一和第二音叉齿中的每一个的第一和第二主表面中的至少一个中，使得仅所述至少一个凹槽的所述第一表面直接相对 相应的音叉齿的第一侧表面和至少一个凹槽的宽度大于或等于从至少一个凹槽的外边缘测量的至少一个凹槽的宽度方向上的距离， 第一和第二音叉尖齿中相应的一个的外边缘小于0.07mm。

公开(公告)号：US08866567B2

公开(公告)日：2014-10-21

申请号：US13767934

申请日：2013-02-15

申请人： Piedek Technical Laboratory

发明人： Hirofumi Kawashima

IPC分类号： H03H9/215 ,  H03B5/32 ,  H03B5/36 ,  H01L41/053 ,  H03H9/10 ,  H03H9/05 ,  H04R31/00 ,  H03H9/21 ,  H01L41/04 ,  H01L41/22 ,  H04R17/00 ,  H03H3/02 ,  H03H3/04

CPC分类号： H03H9/21 ,  H01L41/04 ,  H01L41/22 ,  H03B5/32 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/1021 ,  H03H9/215 ,  H03H2003/026 ,  H03H2003/0492 ,  H04R17/00 ,  H04R31/00 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4908 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49135

摘要： A quartz crystal unit has a quartz crystal tuning fork resonator having a thickness within a range of 0.05 mm to 0.18 mm, and at least one groove formed in at least one of opposite main surfaces of each of first and second tuning fork tines so that a length of the at least one groove is within a range of 20% to 78% of an overall length of the resonator and less than 1.29 mm. An electrode is disposed on at least one of a base portion and a surface of the at least one groove so that the electrode of the first tuning fork tine has an electrical polarity opposite to an electrical polarity of the electrode of the second tuning fork tine. The capacitance ratio r2 of a second overtone mode of vibration of the quartz crystal tuning fork resonator is greater than 1500. The quartz crystal tuning fork resonator is housed in a case having an open end, and a lid is connected to the case.

摘要翻译： 石英晶体单元具有厚度在0.05mm至0.18mm范围内的石英晶体谐振器谐振器，并且至少一个沟槽形成在第一和第二音叉中的至少一个相对的主表面中，从而使得 至少一个槽的长度在谐振器的总长度的20％至78％的范围内，小于1.29mm。 电极设置在至少一个凹槽的基部和表面中的至少一个上，使得第一音叉齿的电极具有与第二音叉齿的电极的电极性相反的电极性。 石英音叉谐振器的第二泛音振动模式的电容比r2大于1500.石英音叉谐振器容纳在具有开口端的壳体中，并且盖连接到壳体。

公开(公告)号：US08832933B2

公开(公告)日：2014-09-16

申请号：US13233079

申请日：2011-09-15

申请人： Yung-Hsin Kuo ,  Wensen Hung ,  Po-Shi Yao

发明人： Yung-Hsin Kuo ,  Wensen Hung ,  Po-Shi Yao

IPC分类号： H05K3/34 ,  G01R3/00 ,  H05K3/00 ,  G01R1/073 ,  G01R1/067

CPC分类号： G01R1/07314 ,  G01R1/0491 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  H01L2924/14 ,  H05K3/00 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49865 ,  Y10T29/49867

摘要： A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

摘要翻译： 用于晶圆级测试的半导体IC封装器件的测试探针卡。 该卡包括一个包括测试电路和测试头的电路板。 探头包括探针阵列，其具有附接到包括多个导电通孔的基底的多个金属测试探针。 在一个实施例中，探针具有相对刚性的结构，并且具有可以使用倒装芯片组件焊料回流工艺电连接到通孔的一端。 在一个实施例中，探针可以使用反向导线放电加工由导电材料的整体块形成。

公开(公告)号：US20140227891A1

公开(公告)日：2014-08-14

申请号：US13767009

申请日：2013-02-14

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Allan Jerome Daen Rapales ,  Floro Lopez Camenforte, III ,  John Paul Quianzon Kwo

IPC分类号： H01G2/06 ,  H01G13/00

CPC分类号： H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/301 ,  H05K3/3452 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/046 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/43 ,  Y10T29/49135

摘要： An interdigitated chip capacitor (“IDC”) assembly including an IDC having a semiconductor block with a top portion, a bottom portion opposite the top portion, a plurality of sidewall portions extending between the top and bottom portions, and a plurality of terminals located on the sidewall portions; and a substrate having a top portion with a plurality of generally flat, vertically extending, nonconductive abutment surfaces thereon, the sidewall portions of the IDC being abuttingly engaged with at least some of the plurality of abutment surfaces.

摘要翻译： 一种交错式片状电容器（“IDC”）组件，包括具有顶部的半导体块的IDC，与顶部相对的底部，在顶部和底部之间延伸的多个侧壁部分，以及位于 侧壁部分; 以及具有在其上具有多个大致平坦的，垂直延伸的非导电邻接表面的顶部的基底，所述IDC的侧壁部分与多个邻接表面中的至少一些邻接地接合。

公开(公告)号：US20130074332A1

公开(公告)日：2013-03-28

申请号：US13626477

申请日：2012-09-25

申请人： NGK SPARK PLUG CO., LTD.

发明人： Kenji SUZUKI

IPC分类号： H05K3/38 ,  H05K3/30

CPC分类号： H05K3/306 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/1531 ,  H05K1/0218 ,  H05K1/0222 ,  H05K1/185 ,  H05K3/0094 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09981 ,  H05K2201/10712 ,  H05K2203/1394 ,  Y10T29/49133 ,  Y10T29/49135 ,  H01L2924/00

摘要： A method of manufacturing a component-built-in wiring substrate which exhibits excellent reliability, through improvement of adhesion between a resin filler and a core substrate, is provided. In some embodiments the method comprises a core substrate preparation step for preparing a core substrate, an accommodation-hole forming step for forming an accommodation hole in the core substrate, and a through-hole forming step for forming through-holes. In a plating-layer forming step, a plating layer is formed on an inner wall surface of the accommodation hole and plating layers are formed on the inner wall surfaces of the through-holes, which become through-hole conductors each having a hollow. In an accommodation step, a component is accommodated in the accommodation hole. In a resin charging step, a resin filler is filled into a gap between component side-surfaces and the inner wall surface of the accommodation hole and into the hollows.

公开(公告)号：US08375559B2

公开(公告)日：2013-02-19

申请号：US12927314

申请日：2010-11-10

申请人： Hirofumi Kawashima

发明人： Hirofumi Kawashima

IPC分类号： H04R31/00

CPC分类号： H03H9/21 ,  H01L41/04 ,  H01L41/22 ,  H03B5/32 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/1021 ,  H03H9/215 ,  H03H2003/026 ,  H03H2003/0492 ,  H04R17/00 ,  H04R31/00 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4908 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49135

摘要： A method of manufacturing a quartz crystal unit comprises disposing a metal film on opposite surfaces of a quartz crystal wafer and then etching the wafer to form a two-line tuning fork resonator vibratable in a flexural mode of an inverse phase. A groove is formed in the opposite main surfaces of both tines, and the length of each groove is determined relative to the length of the resonator so that the series resistance of the fundamental mode of vibration of the resonator is less than the series resistance of the second overtone mode of vibration thereof. The resonator is then mounted in case after which the resonant frequency of the resonator is adjusted.

摘要翻译： 制造石英晶体单元的方法包括在石英晶片的相对表面上设置金属膜，然后蚀刻晶片以形成以相位相反的弯曲模式振动的双线式音叉谐振器。 在两个尖齿的相对的主表面中形成有槽，并且每个槽的长度相对于谐振器的长度确定，使得谐振器的基本振动模式的串联电阻小于谐振器的串联电阻 第二个泛音振动模式。 然后在共振器的谐振频率被调整之后安装谐振器。

公开(公告)号：US20130019471A1

公开(公告)日：2013-01-24

申请号：US13582520

申请日：2011-04-08

申请人： Takashi Omae ,  Kazuki Zaitsu

发明人： Takashi Omae ,  Kazuki Zaitsu

IPC分类号： H01R43/20

CPC分类号： H01R9/0518 ,  H01R4/34 ,  H01R13/514 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49151 ,  Y10T29/49208

摘要： In order to avoid cost for accommodating a shield wire in a housing while bending, and smoothly and readily accommodate within the housing while the shield electric wire is insulated, a conductive housing 1 including a rear wall 4 continuing to an annular wall 3, and a tube wall 5 continuing to down the rear wall 4, a method comprising the steps of: passing through a shield electric wire 2 from a lower opening 5a of the tube wall of the conductive housing to a front opening 3a of the annular wall while bending the shield electric wire; putting a shield terminal 9 movably around the shield electric wire from top of the shield electric wire; exposing a core wire 2b and a braid 2a of the shield electric wire by stripping a tip thereof; connecting an L-shaped terminal 11 to the core wire; mounting an L-shaped insulation inner housing 12 outside the L-shaped terminal; connecting the shield terminal to the braid; and accommodating a vertical part 14 of the inner housing within the conductive housing by pulling in the shield electric wire in an direction contrary to that of the shield electric wire having being passed through, so as to project a horizontal part 13 of the inner housing from the front opening.

摘要翻译： 为了避免在弯曲时将屏蔽线容纳在壳体中的成本，并且在屏蔽电线绝缘时平滑且容易地容纳在壳体内的导电壳体1包括连续到环形壁3的后壁4和 管壁5继续向下延伸到后壁4，一种方法包括以下步骤：将屏蔽电线2从导电壳体的管壁的下开口5a穿过到环形壁的前开口3a，同时弯曲 屏蔽电线; 将屏蔽端子9从屏蔽电线的顶部可移动地围绕屏蔽电线; 通过剥离其顶端露出屏蔽电线的芯线2b和编织层2a; 将L形端​​子11连接到芯线; 在L形端子外面安装一个L形绝缘内壳12; 将屏蔽端子连接到编织层; 并且通过沿与所穿过的屏蔽电线的方向相反的方向拉动屏蔽电线，将内壳体的垂直部分14容纳在导电壳体内，以使内壳体的水平部分13从 前开口

公开(公告)号：US08240023B2

公开(公告)日：2012-08-14

申请号：US12386292

申请日：2009-04-16

申请人： Hirofumi Kawashima

发明人： Hirofumi Kawashima

IPC分类号： H04R31/00

CPC分类号： H03B5/32 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/1021 ,  H03H9/21 ,  H03H9/215 ,  H03H2003/026 ,  H03H2003/0492 ,  H04R17/00 ,  H04R31/00 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4908 ,  Y10T29/49133 ,  Y10T29/49135

摘要： A method for manufacturing a quartz crystal unit comprises the steps of forming a quartz crystal tuning fork resonator vibratable in a flexural mode of an inverse phase and having a quartz crystal tuning fork base and first and second quartz crystal tuning fork tines connected to the quartz crystal tuning fork base, forming at least one groove having at least three stepped portions in at least one of opposite main surfaces of each of first and second quartz crystal tuning fork tines, disposing an electrode on a surface of one of the at least three stepped portions of the at least one groove and an electrode on one of opposite side surfaces of each of the first and second quartz crystal tuning fork tines, mounting the quartz crystal tuning fork resonator on a mounting portion of a case, and connecting a lid to the case to cover an open end of the case, wherein the step of forming the quartz crystal tuning fork base and the first and second quartz crystal tuning fork tines is performed before the step of forming the at least one groove having the at least three stepped portions.

摘要翻译： 一种制造石英晶体单元的方法包括以下步骤：形成能够以反相的弯曲模式振动并具有石英晶体拨叉基座的石英音叉式谐振器，以及连接到石英晶体的第一和第二石英晶体音叉齿 音叉基座，在第一和第二石英音叉齿中的每一个的至少一个主表面中形成至少一个具有至少三个阶梯部分的凹槽，在至少三个阶梯部分之一的表面上设置电极 所述至少一个槽和所述第一和第二石英晶体叉齿中的每一个的相对侧表面中的一个电极上的电极，将所述石英音叉谐振器安装在壳体的安装部分上，并将盖连接到所述壳体 为了覆盖壳体的开口端，其中形成石英音叉基座和第一和第二石英晶体音叉尖的步骤执行b 在形成具有至少三个阶梯部分的至少一个凹槽的步骤之前。