公开(公告)号：US07679909B2

公开(公告)日：2010-03-16

申请号：US11779709

申请日：2007-07-18

申请人： Ian Spearing ,  Tim Schrader

发明人： Ian Spearing ,  Tim Schrader

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： E05D11/00 ,  E05D5/02 ,  E05D5/121 ,  E05D7/1044 ,  E05D11/0081 ,  E05D2003/027 ,  E05D2005/122 ,  E05Y2600/622 ,  E05Y2800/10 ,  E05Y2900/208 ,  H05K7/20645 ,  Y10T16/557

摘要： The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

摘要翻译： 本公开描述了用于将两个结构可旋转地安装在一起的旋转铰链组件，使得结构通过流体流动而流体连通，以及包括这种铰链组件的系统。 旋转铰链组件通常包括流体入口端口，流体出口端口，围绕入口端口和出口端口并允许围绕一个或多个轴线旋转的轴以及可与铰链组件的轴一体形成的连接装置。 在使用中，这些组件消除了用于将门和结构连接在一起的辅助铰链或二次安装硬件的用途，以便保持电子机架与安装在电子机架的门上的热交换器之间的流体连通。

公开(公告)号：US20080018212A1

公开(公告)日：2008-01-24

申请号：US11779709

申请日：2007-07-18

申请人： Ian Spearing ,  Tim Schrader

发明人： Ian Spearing ,  Tim Schrader

IPC分类号： A47B77/08 ,  E05D7/00

CPC分类号： E05D11/00 ,  E05D5/02 ,  E05D5/121 ,  E05D7/1044 ,  E05D11/0081 ,  E05D2003/027 ,  E05D2005/122 ,  E05Y2600/622 ,  E05Y2800/10 ,  E05Y2900/208 ,  H05K7/20645 ,  Y10T16/557

摘要： The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

摘要翻译： 本公开描述了用于将两个结构可旋转地安装在一起的旋转铰链组件，使得结构通过流体流动而流体连通，以及包括这种铰链组件的系统。 旋转铰链组件通常包括流体入口端口，流体出口端口，围绕入口端口和出口端口并允许围绕一个或多个轴线旋转的轴以及可与铰链组件的轴一体形成的连接装置。 在使用中，这些组件消除了用于将门和结构连接在一起的辅助铰链或二次安装硬件的用途，以便保持电子机架与安装在电子机架的门上的热交换器之间的流体连通。

公开(公告)号：US20070201210A1

公开(公告)日：2007-08-30

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US20070201204A1

公开(公告)日：2007-08-30

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US07599184B2

公开(公告)日：2009-10-06

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US07539020B2

公开(公告)日：2009-05-26

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/16

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US09782120B2

公开(公告)日：2017-10-10

申请号：US14268667

申请日：2014-05-02

申请人： Tim Schrader

发明人： Tim Schrader

IPC分类号： A61B5/02 ,  A61B5/00 ,  A61B5/0245 ,  A61B5/026 ,  A61B17/74

CPC分类号： A61B5/4571 ,  A61B5/0245 ,  A61B5/026 ,  A61B5/6878 ,  A61B17/742 ,  A61B2505/05

摘要： Concepts for measuring and monitoring characteristics of osseous tissue are presented. In various embodiments, a monitoring probe may be inserted through a hollow passageway within a cannulated screw during an operation in order to measure characteristics of the osseous tissue in which the cannulated screw is inserted. In various embodiments, the cannulated screw may be inserted into a femoral head, through a physis, and into an epiphysis for stabilization of Slipped Capital Femoral Epiphysis. During surgical treatment thereof, a pressure transducer may be inserted into the osseous tissue through the cannulated screw in order to monitor epiphysis perfusion through the femoral head.