公开(公告)号：US07599184B2

公开(公告)日：2009-10-06

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US07539020B2

公开(公告)日：2009-05-26

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/16

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US20070201210A1

公开(公告)日：2007-08-30

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US20070201204A1

公开(公告)日：2007-08-30

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US07679909B2

公开(公告)日：2010-03-16

申请号：US11779709

申请日：2007-07-18

申请人： Ian Spearing ,  Tim Schrader

发明人： Ian Spearing ,  Tim Schrader

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： E05D11/00 ,  E05D5/02 ,  E05D5/121 ,  E05D7/1044 ,  E05D11/0081 ,  E05D2003/027 ,  E05D2005/122 ,  E05Y2600/622 ,  E05Y2800/10 ,  E05Y2900/208 ,  H05K7/20645 ,  Y10T16/557

摘要： The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

摘要翻译： 本公开描述了用于将两个结构可旋转地安装在一起的旋转铰链组件，使得结构通过流体流动而流体连通，以及包括这种铰链组件的系统。 旋转铰链组件通常包括流体入口端口，流体出口端口，围绕入口端口和出口端口并允许围绕一个或多个轴线旋转的轴以及可与铰链组件的轴一体形成的连接装置。 在使用中，这些组件消除了用于将门和结构连接在一起的辅助铰链或二次安装硬件的用途，以便保持电子机架与安装在电子机架的门上的热交换器之间的流体连通。

公开(公告)号：US20080018212A1

公开(公告)日：2008-01-24

申请号：US11779709

申请日：2007-07-18

申请人： Ian Spearing ,  Tim Schrader

发明人： Ian Spearing ,  Tim Schrader

IPC分类号： A47B77/08 ,  E05D7/00

CPC分类号： E05D11/00 ,  E05D5/02 ,  E05D5/121 ,  E05D7/1044 ,  E05D11/0081 ,  E05D2003/027 ,  E05D2005/122 ,  E05Y2600/622 ,  E05Y2800/10 ,  E05Y2900/208 ,  H05K7/20645 ,  Y10T16/557

摘要： The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

摘要翻译： 本公开描述了用于将两个结构可旋转地安装在一起的旋转铰链组件，使得结构通过流体流动而流体连通，以及包括这种铰链组件的系统。 旋转铰链组件通常包括流体入口端口，流体出口端口，围绕入口端口和出口端口并允许围绕一个或多个轴线旋转的轴以及可与铰链组件的轴一体形成的连接装置。 在使用中，这些组件消除了用于将门和结构连接在一起的辅助铰链或二次安装硬件的用途，以便保持电子机架与安装在电子机架的门上的热交换器之间的流体连通。

公开(公告)号：US20090251094A1

公开(公告)日：2009-10-08

申请号：US12416534

申请日：2009-04-01

申请人： Ian Spearing

发明人： Ian Spearing

IPC分类号： G05B13/02

CPC分类号： G05B13/0205

摘要： A system and control method mitigates hysteresis of an adjustable component in the system. A control module can allow small control changes to be effected to the component within limits of the component's and/or the system's normal hysteresis band. The control method can allow finer, more accurate and more aggressive control to be obtained from the component. The system and method can utilize two separate control regimes to control adjustments to the component. The first control regime can control changes larger than a hysteresis band and/or changes in a same direction as the last adjustment that was performed with the first control regime. The first control regime can be a feedback-based adjustment to the component. The second control regime can be utilized to control changes within the hysteresis band. The second control regime can use open-loop based adjustments to the component.

摘要翻译： 系统和控制方法减轻系统中可调组件的滞后。 控制模块可以允许在组件和/或系统的正常滞后带的限度内对组件进行小的控制改变。 控制方法可以从组件获得更精细，更准确和更积极的控制。 该系统和方法可以利用两个单独的控制方案来控制对组件的调整。 第一控制方案可以控制大于滞后带的变化和/或与第一控制方式执行的最后调整方向相同的方向的变化。 第一种控制方式可以是对组件的基于反馈的调整。 第二控制方案可用于控制滞后带内的变化。 第二个控制方式可以使用基于开环的调整组件。

公开(公告)号：US08833097B2

公开(公告)日：2014-09-16

申请号：US13185637

申请日：2011-07-19

申请人： Ian Spearing

发明人： Ian Spearing

IPC分类号： G06F1/20 ,  H05K7/20 ,  F28D15/00 ,  F28F9/02

CPC分类号： H05K7/20281 ,  F28D15/00 ,  F28F9/02 ,  G06F1/20 ,  H05K7/20 ,  H05K7/20645

摘要： The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow rate, in combination with one or more individual orifices that allow further flow distribution as required by individual cold plates, despite flow variations upstream of the orifices. An orifice can be coupled to an orifice holder, which includes a body to support the orifice, and which may be coupled (directly or indirectly) to an inlet of the cold plate. Alternative manners of coupling orifices in the fluid flow besides an orifice holder can be employed. Generally, the flow regulator(s) is coupled with a plurality of orifices and conduits through which the cooling fluid flows. Related system components can be assembled as a module for installation into a cooling system that includes other system components such as a pump, compressor or other pressure sources for the cooling fluid.

摘要翻译： 本公开提供了用于通过多个散热器（例如冷板）调节和分配冷却流体的系统和方法，所述冷却器使用流量调节器，其将总流量与一个或多个允许进一步流量分配的单个孔组合， 各个冷板需要，尽管孔口上游有流动变化。 孔口可以联接到孔保持器，孔保持器包括用于支撑孔口的主体，并且其可以（直接地或间接地）联接到冷板的入口。 可以使用除了孔口保持器之外的流体流动中的联接孔的替代方式。 通常，流量调节器与多个通过冷却流体流过的孔和导管联接。 相关的系统组件可以组装成用于安装到包括其它系统部件（例如泵，压缩机或其它用于冷却流体的压力源）的冷却系统的模块。

公开(公告)号：US20110272125A1

公开(公告)日：2011-11-10

申请号：US13185637

申请日：2011-07-19

申请人： Ian Spearing

发明人： Ian Spearing

IPC分类号： F28F9/02

CPC分类号： H05K7/20281 ,  F28D15/00 ,  F28F9/02 ,  G06F1/20 ,  H05K7/20 ,  H05K7/20645

摘要： The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow rate, in combination with one or more individual orifices that allow further flow distribution as required by individual cold plates, despite flow variations upstream of the orifices. An orifice can be coupled to an orifice holder, which includes a body to support the orifice, and which may be coupled (directly or indirectly) to an inlet of the cold plate. Alternative manners of coupling orifices in the fluid flow besides an orifice holder can be employed. Generally, the flow regulator(s) is coupled with a plurality of orifices and conduits through which the cooling fluid flows. Related system components can be assembled as a module for installation into a cooling system that includes other system components such as a pump, compressor or other pressure sources for the cooling fluid.

摘要翻译： 本公开提供了用于通过多个散热器（例如冷板）调节和分配冷却流体的系统和方法，所述冷却器使用流量调节器，其将总流量与一个或多个允许进一步流量分配的单个孔组合， 各个冷板需要，尽管孔口上游有流动变化。 孔口可以联接到孔保持器，孔保持器包括用于支撑孔口的主体，并且其可以（直接地或间接地）联接到冷板的入口。 可以使用除了孔口保持器之外的流体流动中的联接孔的替代方式。 通常，流量调节器与多个通过冷却流体流过的孔和导管联接。 相关的系统组件可以组装成用于安装到包括其它系统部件（例如泵，压缩机或其它用于冷却流体的压力源）的冷却系统的模块。

公开(公告)号：US20050241328A1

公开(公告)日：2005-11-03

申请号：US10955330

申请日：2004-09-30

申请人： Terry Craps ,  Ian Spearing ,  Matthew Brown ,  John Voshell ,  John Ruth

发明人： Terry Craps ,  Ian Spearing ,  Matthew Brown ,  John Voshell ,  John Ruth

IPC分类号： F25B5/00 ,  F25B5/02 ,  F25B15/00 ,  F25B39/02 ,  F25B40/00 ,  F25B41/04 ,  F25B49/02 ,  F25D23/12 ,  G01K20060101

CPC分类号： F25B40/00 ,  F25B5/02 ,  F25B49/02 ,  F25B2341/0652 ,  F25B2400/01 ,  F25B2400/0409 ,  F25B2400/0411 ,  F25B2400/0417 ,  F25B2400/0419 ,  F25B2600/2513 ,  Y02B30/72

摘要： An apparatus for controlling the temperature of an electronic device. The apparatus comprises a refrigeration system including a compressor and a multi-pass heat exchanger. The refrigeration system is operative to circulate a refrigerant fluid through a fluid flow loop such that the refrigerant fluid will change between gaseous and liquid states to alternately absorb and release thermal energy. The refrigerant fluid is pre-cooled in the heat exchanger by a pre-cooling refrigerant stream. A thermal head is connected into the fluid flow loop and has a temperature controlled surface.

摘要翻译： 一种用于控制电子装置的温度的装置。 该装置包括具有压缩机和多通道热交换器的制冷系统。 制冷系统用于使制冷剂流体循环通过流体流动回路，使得制冷剂流体将在气态和液态之间改变以交替地吸收和释放热能。 制冷剂流体通过预冷却的制冷剂流在热交换器中被预冷却。 热头连接到流体流动回路中并具有温度控制表面。