公开(公告)号：US08678739B2

公开(公告)日：2014-03-25

申请号：US11628843

申请日：2005-06-20

申请人： Ikuo Ogasawara ,  Yoshiyasu Kato

发明人： Ikuo Ogasawara ,  Yoshiyasu Kato

IPC分类号： B65G65/00

CPC分类号： H01L21/67379 ,  H01L21/67775

摘要： A carrier supporting apparatus is configured to support a carrier containing a plurality of plate-like objects to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of one object to be processed. The carrier supporting apparatus comprises a placing table adapted to place the carrier thereon, a lifting member that can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism. When raised, the lifting member raises a bottom face of the object to be processed, which is supported on a set of the lowermost supporting stages in the carrier, and lifts it up from the supporting stages.

摘要翻译： 载体支撑装置被构造成支撑包含待处理的多个板状物体的载体，使得每个待处理物体以水平姿态的间隔垂直地布置。 载体包括多组各自以一定间隔垂直布置的支撑台，其中每组支撑台构造成支撑待处理物体底面的周边。 载体支撑装置包括适于将载体放置在其上的放置台，可相对于放置台升高和降低的提升构件以及适于驱动提升机构的驱动机构。 当升起时，提升构件升高被处理物体的底面，该底面被支撑在载体中的一组最下面的支撑台上，并从支撑台提升。

公开(公告)号：US07411384B2

公开(公告)日：2008-08-12

申请号：US11682703

申请日：2007-03-06

申请人： Ikuo Ogasawara ,  Yoshiyasu Kato

发明人： Ikuo Ogasawara ,  Yoshiyasu Kato

IPC分类号： G01R31/28 ,  G01R31/02

CPC分类号： H01L21/68742 ,  G01R31/2886 ,  G01R31/2893

摘要： A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided.

摘要翻译： 晶片卡盘具有在安装台上沿垂直方向形成的多个通孔中突出和退避的多个销，以及用于使销升降的上/下降机构。 晶片卡盘通过从安装台的安装平面突出销而接收晶片。 在销的每个上端表面上设置接收表面部分，用于基本上不在销和每个相应的通孔之间形成间隙，并且提供用于使接收表面部分与安装表面对准的机构。

公开(公告)号：US20090245979A1

公开(公告)日：2009-10-01

申请号：US11628843

申请日：2005-06-20

申请人： Ikuo Ogasawara ,  Yoshiyasu Kato

发明人： Ikuo Ogasawara ,  Yoshiyasu Kato

IPC分类号： H01L21/68

CPC分类号： H01L21/67379 ,  H01L21/67775

摘要： A carrier supporting apparatus (10) according to the present invention is configured to support a carrier (C) containing, therein, a plurality of substantially plate-like objects (D) to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages (bottom faces of grooves (1A)) each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of each one object (D) to be processed. The carrier supporting apparatus comprises a placing table (11) adapted to place the carrier (C) thereon, a lifting member (12) provided such that it can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism to be raised and lowered. When raised, the lifting member (12) raises a bottom face of the object (D) to be processed, which is supported on a set of the lowermost supporting stages in the carrier (C), and lifts it up from the supporting stages.

摘要翻译： 根据本发明的载体支撑装置（10）被配置为支撑载体（C），所述载体（C）在其中容纳有待处理的多个基本上板状的物体（D），使得每个待处理物体垂直布置 以水平姿态的间隔。 载体包括多组各自以一定间隔垂直布置的支撑台（凹槽（1A）的底面），其中每组支撑台被构造成将每个物体（D）的底面的周边支撑为 处理。 载体支撑装置包括适于将载体（C）放置在其上的放置台（11），设置成使其相对于放置台升高和降低的提升构件（12），以及适于驱动 提升机构升高降低。 升起时，升降构件（12）升起待加工物体（D）的底面，被支撑在载体（C）中的一组最下面的支撑台上，并将其从支撑台提升。

公开(公告)号：US20070152691A1

公开(公告)日：2007-07-05

申请号：US11682703

申请日：2007-03-06

申请人： Ikuo OGASAWARA ,  Yoshiyasu Kato

发明人： Ikuo OGASAWARA ,  Yoshiyasu Kato

IPC分类号： G01R31/02

CPC分类号： H01L21/68742 ,  G01R31/2886 ,  G01R31/2893

摘要： A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided.

摘要翻译： 晶片卡盘具有在安装台上沿垂直方向形成的多个通孔中突出和退避的多个销，以及用于使销升降的上/下降机构。 晶片卡盘通过从安装台的安装平面突出销而接收晶片。 在销的每个上端表面上设置接收表面部分，用于基本上不在销和每个相应的通孔之间形成间隙，并且提供用于使接收表面部分与安装表面对准的机构。