公开(公告)号：US06301167B1

公开(公告)日：2001-10-09

申请号：US09638385

申请日：2000-08-12

申请人： Ill Young Lee ,  Sang Sik Lee ,  Jong Hyun Kim ,  Duk Chun Park ,  Byung Soo Ham ,  Byung Koo Ham

发明人： Ill Young Lee ,  Sang Sik Lee ,  Jong Hyun Kim ,  Duk Chun Park ,  Byung Soo Ham ,  Byung Koo Ham

IPC分类号： G11C700

CPC分类号： G11C29/56

摘要： An apparatus for testing a semiconductor memory is disclosed, which includes a power control module for varying an output voltage of the power supply unit and supplying to the semiconductor memory in accordance with a power control signal from a CPU(Central Processing Unit) of the main board, and an interface unit for supplying the power control signal from the CPU of the main board to the power control module, thus implementing an accurate operation state of an actual mounting environment of a semiconductor memory device by varying and supplying a certain voltage supplied from a power supply unit when testing whether a semiconductor memory device is defective or not using a main board of a computer apparatus.

摘要翻译： 公开了一种用于测试半导体存储器的装置，其包括用于改变电源单元的输出电压并根据来自主体的CPU（中央处理单元）的功率控制信号向半导体存储器供应的功率控制模块 以及用于将来自主板的CPU的功率控制信号提供给功率控制模块的接口单元，从而通过改变和提供从半导体存储器件提供的一定电压来实现半导体存储器件的实际安装环境的精确操作状态 当使用计算机装置的主板来测试半导体存储器件是否有故障时，电源单元。

公开(公告)号：US6131919A

公开(公告)日：2000-10-17

申请号：US344199

申请日：1999-06-24

申请人： Sang Sik Lee ,  Kie Seok Oh

发明人： Sang Sik Lee ,  Kie Seok Oh

IPC分类号： B60G1/04 ,  B60G17/00 ,  B60G17/016 ,  B60G21/06 ,  B60K17/04 ,  B60P1/16

CPC分类号： B60G17/016 ,  B60G21/06 ,  B60K17/043 ,  B60G2200/10 ,  B60G2200/32 ,  B60G2200/422 ,  B60G2200/44 ,  B60G2202/413 ,  B60G2202/414 ,  B60G2204/128 ,  B60G2204/129 ,  B60G2204/80 ,  B60G2206/30 ,  B60G2300/082 ,  B60G2600/182 ,  B60G2800/019 ,  B60Y2200/221

摘要： Disclosed is a method of adjusting a tractor to a horizontal position and an apparatus for performing the same. The method comprises the steps of determining whether or not the tractor is in an automatic mode, determining whether the tractor is in a flat land or in a slope land if the tractor is in the automatic mode, adjusting a height of the body with respect to a ground if the tractor is in the flat land, determining a driving direction of the tractor if the tractor is in the slope land, adjusting the body to the horizontal position by controlling the body in left and right directions thereof if the tractor is driving in a contour direction, adjusting the body to the horizontal position by controlling the body in front and rear directions thereof if the tractor is driving in a latitudinal direction, and adjusting the body to the horizontal position by controlling the body in front, rear, left and right directions thereof if the tractor is driving in an oblique direction. The body of the tractor can be maintained to the horizontal position while the tractor is driving and the height of the body with respect to the ground can be adjusted, so the crops can be prevented from being damaged. The apparatus can rapidly adjust the body of the tractor to the horizontal position.

摘要翻译： 公开了一种将拖拉机调节到水平位置的方法和用于执行该拖拉机的装置。 该方法包括以下步骤：确定拖拉机是否处于自动模式，如果拖拉机处于自动模式，则确定拖拉机是在平坦地面还是在坡地上，相对于 如果拖拉机在平坦的地面，则确定拖拉机的行驶方向，如果拖拉机处于斜坡地面，则如果拖拉机正在行驶，则通过控制车体的左右方向将车身调整到水平位置 轮廓方向，如果拖拉机在纬向方向上行驶，则通过在前后方向上控制身体来将身体调整到水平位置，并且通过前后左右控制身体将身体调节到水平位置， 如果拖拉机在倾斜方向上行驶，则其方向正确。 拖拉机的主体可以在拖拉机驾驶时保持在水平位置，并且可以调节车身相对于地面的高度，从而可以防止作物受损。 该设备可以将拖拉机的主体快速调整到水平位置。

公开(公告)号：US06335629B1

公开(公告)日：2002-01-01

申请号：US09115910

申请日：1998-07-15

申请人： Sang Sik Lee ,  Kye Won Ha ,  Jong Wook Kim ,  Chung Koo Yoon

发明人： Sang Sik Lee ,  Kye Won Ha ,  Jong Wook Kim ,  Chung Koo Yoon

IPC分类号： G01R3102

CPC分类号： G01R1/0433 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A testing module for use in testing a semiconductor chip for failures in its integrated circuits includes a test fixture, and a decapsulated semiconductor device package mounted to the fixture. The semiconductor device package includes a semiconductor chip having an active front surface at which the integrated circuits are formed, a back which is opposed to the active front, a plurality of leads for electrically connecting the semiconductor chip to an external apparatus, and a package body having a backside which is decapsulated so as to expose the back of the semiconductor chip. The test fixture includes a fixture body having a loading surface contacting the front of the package body and supporting the semiconductor device package, a cover which has an opening through which the back of the semiconductor chip is exposed, and a plurality of projections contacting the leads of the semiconductor device package. The cover is connected to the fixture body but can be opened to allow the semiconductor device package to be inserted into and removed from the test fixture. The test fixture includes a plurality of connection pins having inner ends that are electrically connected to the leads of the semiconductor device package, and outer ends which protrude from the fixture body and are electrically connected to external testing apparatus.

摘要翻译： 用于测试其集成电路中的故障的半导体芯片的测试模块包括测试夹具和安装到固定装置上的解封装的半导体器件封装。 半导体器件封装包括具有形成集成电路的有源前表面的半导体芯片，与有源前端相对的背面，用于将半导体芯片电连接到外部设备的多个引线和封装体 具有被封装的背面以露出半导体芯片的背面。 测试夹具包括具有接合包装体的前部并且支撑半导体器件封装的负载表面的固定体，具有露出半导体芯片背面的开口的盖，以及与引线接触的多个突起 的半导体器件封装。 盖子连接到固定装置本体上，但是可以打开以使半导体器件封装件插入测试夹具中并从测试夹具中移除。 测试夹具包括多个连接销，其内端电连接到半导体器件封装的引线，外端从固定体突出并与外部测试装置电连接。