公开(公告)号：US20030043731A1

公开(公告)日：2003-03-06

申请号：US09946011

申请日：2001-09-04

Applicant: Imation Corp.

Inventor： Donald J. Kerfeld ,  Douglas J. Chaput ,  Jathan D. Edwards ,  Chad R. Sandstrom

IPC: G11B003/70 ,  B29D017/00 ,  G11B005/84 ,  G11B007/26 ,  B28B001/14 ,  B29C039/00 ,  B29C039/02 ,  B29C039/22 ,  B29C041/00 ,  B29C041/02 ,  B29C041/34

CPC classification number: B29D17/005 ,  B29C45/2632 ,  B29C2045/2661 ,  B29K2995/0097 ,  G11B5/8404 ,  G11B7/263

Abstract: The invention is directed toward techniques for creating molded substrates for use in various different data storage media. The molded substrates have improved thickness profiles that can improve media quality, and in some cases facilitate higher data storage densities. In many cases, the improved thickness profile is a thickness profile that has improved flatness. Mechanical flatness or optical flatness can be achieved. In particular, optical flatness is desirable for substrates used in holographic data storage media having a sandwiched construction.

Abstract translation: 本发明涉及用于创建用于各种不同数据存储介质的模制基板的技术。 模制的基底具有改善的厚度轮廓，其可以改善介质质量，并且在一些情况下有利于更高的数据存储密度。 在许多情况下，改进的厚度轮廓是具有改善的平坦度的厚度轮廓。 可实现机械平面度或光学平面度。 特别地，对于具有夹层结构的全息数据存储介质中使用的基板，光学平面度是理想的。

公开(公告)号：US20020135829A1

公开(公告)日：2002-09-26

申请号：US09812518

申请日：2001-03-20

Applicant: Imation Corp.

Inventor： Jathan D. Edwards ,  Frank E. Aspen ,  Ramon F. Hegel ,  Chad R. Sandstrom

IPC: G03H001/02

CPC classification number: G11B7/24047 ,  G03H1/02 ,  G03H2250/37 ,  G03H2260/12 ,  G03H2270/14 ,  G11B7/0065 ,  G11B7/24044 ,  G11B7/242 ,  G11B7/245 ,  G11B7/2533 ,  G11B7/2534 ,  G11B7/263 ,  Y10S359/90

Abstract: In one embodiment, holographic data storage medium includes a first thermoplastic substrate portion having a thickness less than approximately 2 millimeters and a second thermoplastic substrate portion having a thickness less than approximately 2 millimeters. A holographic recording material may be sandwiched between the first and second thermoplastic substrate portions. By making thermoplastic substrate portions sufficiently thin, edge wedge problems can be avoided.

Abstract translation: 在一个实施例中，全息数据存储介质包括厚度小于约2毫米的第一热塑性基底部分和厚度小于约2毫米的第二热塑性基底部分。 全息记录材料可夹在第一和第二热塑性基材部分之间。 通过使热塑性基材部分足够薄，可以避免边缘楔形问题。