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公开(公告)号:US07583509B2
公开(公告)日:2009-09-01
申请号:US11325083
申请日:2006-01-04
申请人: In-su Choi , Joon-hee Lee , Hee-joo Choi , Il-guy Jung
发明人: In-su Choi , Joon-hee Lee , Hee-joo Choi , Il-guy Jung
IPC分类号: H05K1/00
CPC分类号: G11C5/063 , G11C5/04 , H05K1/148 , H05K2201/10159
摘要: A memory module and a memory system are provided. The memory module includes a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory chip is mounted, and a flexible coupler electrically connecting the first circuit board to the second circuit board. The memory module is bendable and is configured to extend around a memory controller. The memory chips are electrically coupled with the memory controller via a respective plurality of signal lines. The bendable memory module is configured to be bent around the memory controller such that respective lengths of the signal lines are equal.
摘要翻译: 提供了存储器模块和存储器系统。 存储器模块包括其上安装有至少一个存储器芯片的第一电路板,安装至少一个存储器芯片的第二电路板和将第一电路板电连接到第二电路板的柔性耦合器。 存储器模块是可弯曲的并且被配置为围绕存储器控制器延伸。 存储器芯片通过相应的多个信号线与存储器控制器电耦合。 可弯曲存储器模块被配置为围绕存储器控制器弯曲,使得信号线的相应长度相等。
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公开(公告)号:US20060176723A1
公开(公告)日:2006-08-10
申请号:US11325083
申请日:2006-01-04
申请人: In-su Choi , Joon-hee Lee , Hee-joo Choi , Il-guy Jung
发明人: In-su Choi , Joon-hee Lee , Hee-joo Choi , Il-guy Jung
IPC分类号: G11C5/02
CPC分类号: G11C5/063 , G11C5/04 , H05K1/148 , H05K2201/10159
摘要: A memory module and a memory system are provided. The memory module includes a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory chip is mounted, and a flexible coupler electrically connecting the first circuit board to the second circuit board. The memory module is bendable and is configured to extend around a memory controller. The memory chips are electrically coupled with the memory controller via a respective plurality of signal lines. The bendable memory module is configured to be bent around the memory controller such that respective lengths of the signal lines are equal.
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