Memory module and memory system having the same
    1.
    发明授权
    Memory module and memory system having the same 有权
    内存模块和内存系统具有相同的功能

    公开(公告)号:US07583509B2

    公开(公告)日:2009-09-01

    申请号:US11325083

    申请日:2006-01-04

    IPC分类号: H05K1/00

    摘要: A memory module and a memory system are provided. The memory module includes a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory chip is mounted, and a flexible coupler electrically connecting the first circuit board to the second circuit board. The memory module is bendable and is configured to extend around a memory controller. The memory chips are electrically coupled with the memory controller via a respective plurality of signal lines. The bendable memory module is configured to be bent around the memory controller such that respective lengths of the signal lines are equal.

    摘要翻译: 提供了存储器模块和存储器系统。 存储器模块包括其上安装有至少一个存储器芯片的第一电路板,安装至少一个存储器芯片的第二电路板和将第一电路板电连接到第二电路板的柔性耦合器。 存储器模块是可弯曲的并且被配置为围绕存储器控制器延伸。 存储器芯片通过相应的多个信号线与存储器控制器电耦合。 可弯曲存储器模块被配置为围绕存储器控制器弯曲,使得信号线的相应长度相等。

    Memory module and memory system having the same

    公开(公告)号:US20060176723A1

    公开(公告)日:2006-08-10

    申请号:US11325083

    申请日:2006-01-04

    IPC分类号: G11C5/02

    摘要: A memory module and a memory system are provided. The memory module includes a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory chip is mounted, and a flexible coupler electrically connecting the first circuit board to the second circuit board. The memory module is bendable and is configured to extend around a memory controller. The memory chips are electrically coupled with the memory controller via a respective plurality of signal lines. The bendable memory module is configured to be bent around the memory controller such that respective lengths of the signal lines are equal.

    System controlling interface timing in memory module and related method
    3.
    发明授权
    System controlling interface timing in memory module and related method 有权
    内存模块中的系统控制接口时序及相关方法

    公开(公告)号:US07421558B2

    公开(公告)日:2008-09-02

    申请号:US11256108

    申请日:2005-10-24

    IPC分类号: G06F12/06

    CPC分类号: G06F13/1689 G06F13/1694

    摘要: A memory system for controlling interface timing in a memory module and a related timing control method are disclosed. The memory system comprises a memory module having a memory module controller configured to control interface timing of a plurality of memory devices in accordance with memory information and memory signal information. The memory information includes memory initialization information and interface timing information for the plurality of memory devices.

    摘要翻译: 公开了一种用于控制存储器模块中的接口定时的存储系统和相关的定时控制方法。 存储器系统包括具有存储器模块控制器的存储器模块,存储器模块控制器被配置为根据存储器信息和存储器信号信息来控制多个存储器件的接口定时。 存储器信息包括用于多个存储器件的存储器初始化信息和接口定时信息。

    System controlling interface timing in memory module and related method
    4.
    发明申请
    System controlling interface timing in memory module and related method 有权
    内存模块中的系统控制接口时序及相关方法

    公开(公告)号:US20060090054A1

    公开(公告)日:2006-04-27

    申请号:US11256108

    申请日:2005-10-24

    IPC分类号: G06F13/00

    CPC分类号: G06F13/1689 G06F13/1694

    摘要: A memory system for controlling interface timing in a memory module and a related timing control method are disclosed. The memory system comprises a memory module having a memory module controller configured to control interface timing of a plurality of memory devices in accordance with memory information and memory signal information. The memory information includes memory initialization information and interface timing information for the plurality of memory devices.

    摘要翻译: 公开了一种用于控制存储器模块中的接口定时的存储系统和相关的定时控制方法。 存储器系统包括具有存储器模块控制器的存储器模块,存储器模块控制器被配置为根据存储器信息和存储器信号信息来控制多个存储器件的接口定时。 存储器信息包括用于多个存储器件的存储器初始化信息和接口定时信息。

    Method and apparatus to negotiate channel sharing in PLC network
    6.
    发明申请
    Method and apparatus to negotiate channel sharing in PLC network 审中-公开
    在PLC网络中协商通道共享的方法和装置

    公开(公告)号:US20070230497A1

    公开(公告)日:2007-10-04

    申请号:US11705454

    申请日:2007-02-13

    IPC分类号: H04B7/212

    摘要: A method of negotiating channel sharing between adjacent cells when there are a plurality of cells in a power line communication (PLC) network. The method includes attempting to negotiate the channel sharing during a minimum contention access period (CAP) which starts after a maximum beacon period ends and ends before a CAP of each PLC cell ends, wherein the maximum beacon period indicates a maximum size that a beacon frame in a super-frame transmitted from a coordinator of each PLC cell can have. When an attempt to negotiate the channel sharing is made using this method, interference does not occur during channel sharing negotiation, and effective channel sharing can be achieved, thereby eliminating interference between adjacent cells.

    摘要翻译: 当在电力线通信(PLC)网络中存在多个小区时,协商相邻小区之间的信道共享的方法。 该方法包括尝试在最小竞争访问周期(CAP)之间协商信道共享,该最小竞争接入周期(CAP)在最大信标周期结束之后开始,并且在每个PLC小区的CAP结束之前结束,其中最大信标周期指示信标帧 在从每个PLC单元的协调器发送的超帧中可以具有。 当使用该方法尝试协商信道共享时,在信道共享协商期间不会发生干扰,并且可以实现有效的信道共享,从而消除相邻小区之间的干扰。

    Chemical mechanical polishing (CMP) apparatus and CMP method using the
same
    8.
    发明授权
    Chemical mechanical polishing (CMP) apparatus and CMP method using the same 失效
    化学机械抛光(CMP)装置和使用其的CMP方法

    公开(公告)号:US5837610A

    公开(公告)日:1998-11-17

    申请号:US805659

    申请日:1997-02-27

    摘要: A chemical mechanical polishing (CMP) apparatus for planarizing a semiconductor wafer includes a wafer carrier for loading and fixing a semiconductor wafer to be polished and a polishing platen rotating at a constant speed, disposed at a lower portion of the wafer carrier. A polishing pad is provided on an upper surface of the polishing platen, and is in contact with a surface of the semiconductor wafer. A spiral slurry feed line supplies a slurry solution to the polishing pad. An end of the spiral slurry feed line is provided with a plurality of nozzles and the spiral slurry feed line is connected to a deionized water feed line that is opened or closed by a valve. Accordingly, abrasives are prevented from being precipitated, and the slurry solution is uniformly supplied to the semiconductor wafer, to thereby enhance polishing uniformity.

    摘要翻译: 用于平坦化半导体晶片的化学机械抛光(CMP)装置包括用于加载和固定待抛光的半导体晶片的晶片载体和设置在晶片载体的下部的以恒定速度旋转的研磨平板。 抛光垫设置在研磨台板的上表面上并与半导体晶片的表面接触。 螺旋浆料进料管线将浆液提供给抛光垫。 螺旋浆料供给管线的端部设置有多个喷嘴,并且螺旋浆料进料管线连接到由阀打开或关闭的去离子水进料管线。 因此,防止了研磨剂的沉淀,将浆液溶液均匀地供给到半导体晶片,从而提高了研磨均匀性。