公开(公告)号：US20250073752A1

公开(公告)日：2025-03-06

申请号：US18818608

申请日：2024-08-29

Applicant: Industrial Technology Research Institute

Inventor： Chen-Tsai Yang ,  Chih-Cheng Cheng ,  Wan-Hsin Chen ,  Chien-Hsun Chu ,  Li-Wei Yao

IPC: B06B1/06 ,  G08B6/00

Abstract: A multi-tactile feedback component is suitable for an electronic device and includes a thin film deformation element, a thin film vibration element, and a power module. The thin film deformation element has first and second elastic layers and a gain layer disposed therebetween and forming a channel to accommodate a fluid. The thin film vibration element is connected to the thin film deformation element and has a piezoelectric layer and tactile structures. The tactile structures are disposed at a side surface of the piezoelectric layer. The power module is coupled to the thin film deformation element and the thin film vibration element. When the power module supplies an electrical energy to the thin film deformation element, the first elastic layer is deformed to push the fluid and the second elastic layer. When the power module supplies the electrical energy to the thin film vibration element, the piezoelectric layer vibrates.

公开(公告)号：US20240004474A1

公开(公告)日：2024-01-04

申请号：US18343760

申请日：2023-06-29

Applicant: Industrial Technology Research Institute

Inventor： Chen-Tsai Yang ,  Heng-Yin Chen ,  Wan-Chen Yang ,  Jui-Chang Chuang ,  Hung-Hsien Ko ,  Min-Hsiung Liang ,  Chih-Cheng Cheng

IPC: G06F3/01 ,  H10N30/20 ,  H10N30/88 ,  H10N30/80

CPC classification number: G06F3/016 ,  H10N30/20 ,  H10N30/88 ,  H10N30/802

Abstract: A film deformation element includes a first stack and a second stack. The first stack includes a first passivation layer, a first substrate, a first metal layer and a first dielectric layer. The first substrate is disposed on the first passivation layer. The first metal layer is disposed on the first substrate. The first dielectric layer is disposed on the first metal layer. The second stack is bonded to the first stack, to form a sealing space. The second stack includes a second passivation layer, a second substrate, a second metal layer and a second dielectric layer. The second dielectric layer is disposed on and faces the first dielectric layer. The second metal layer is disposed on the second dielectric layer. The second substrate is disposed on the second metal layer. The second passivation layer is disposed on the second substrate.