公开(公告)号：US10913301B2

公开(公告)日：2021-02-09

申请号：US15854247

申请日：2017-12-26

Applicant: Industrial Technology Research Institute

Inventor： Wei-Yuan Chen ,  Yu-Ming Wang ,  Sheng-Yu Lin ,  Yi-Wei Lin

IPC: B32B3/10 ,  B41M5/00 ,  H05K3/10 ,  B32B7/04 ,  B41M7/00 ,  B41M99/00 ,  H05K3/42 ,  B32B15/04

Abstract: An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.

公开(公告)号：US09468095B1

公开(公告)日：2016-10-11

申请号：US14981878

申请日：2015-12-28

Applicant: Industrial Technology Research Institute

Inventor： Yu-Ming Wang ,  Sheng-Yu Lin ,  Kai-Jiun Wang ,  Wei-Yuan Chen

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/00 ,  C23C24/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/422 ,  H05K3/0035 ,  H05K3/185 ,  H05K3/4661

Abstract: A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a substrate. The wiring layer is formed by forming a patterned colloidal layer having a first catalyzer on the substrate, activating the first catalyzer, and forming a conductive layer on a surface of the patterned colloidal layer. The conductive via is formed by forming an insulation colloidal layer containing a second catalyzer on the substrate and the conductive layer and forming at least one opening in the colloidal insulation layer by laser to expose the conductive layer and activate a portion of the second catalyzer. Electroless plating is performed on the activated second catalyzer to form the conductive via in the opening. An interface is between the patterned colloidal layer and the conductive layer in the multilayer wiring structure.

Abstract translation: 提供一种多层布线的制造方法，其中在基板上形成包括布线层和导电孔的多层布线结构。 通过在基板上形成具有第一催化剂的图案化胶体层，活化第一催化剂，并在图案化胶体层的表面上形成导电层，形成布线层。 导电通孔是通过在衬底和导电层上形成含有第二催化剂的绝缘胶体层而形成的，并通过激光在胶体绝缘层中形成至少一个开口以暴露导电层并激活第二催化剂的一部分。 在活化的第二催化剂上进行无电镀以在开口中形成导电通孔。 在图案化的胶体层和多层布线结构中的导电层之间的界面。