公开(公告)号：US20170162826A1

公开(公告)日：2017-06-08

申请号：US15269945

申请日：2016-09-19

Applicant: Industrial Technology Research Institute

Inventor： Tung-Ying Lin ,  Kun-Wei Lin

IPC: H01L51/52 ,  G02F1/1333 ,  G02F1/167 ,  C23C16/515 ,  H01J37/32

CPC classification number: H01L51/5256 ,  C23C16/401 ,  C23C16/515 ,  G02F1/1333 ,  G02F1/167 ,  G02F2001/133337 ,  H01J37/32146 ,  H01J37/3244 ,  H01J2237/327 ,  H01J2237/3321 ,  H01L2251/5346

Abstract: A composite barrier layer including at least one first barrier layer and at least one second barrier layer disposed in a stacking manner is provided. The Si—O—Si linear bond ratio is higher than the Si—O—Si network bond ratio in the first barrier layer. The Si—O—Si network bond ratio is higher than the Si—O—Si linear bond ratio in the second barrier layer.

公开(公告)号：US20250108458A1

公开(公告)日：2025-04-03

申请号：US18827875

申请日：2024-09-09

Applicant: Industrial Technology Research Institute

Inventor： Kun-Wei Lin ,  Tung-Ying Lin ,  Miao-Chang Wu

IPC: B23K26/38 ,  B23K26/082 ,  B23K26/70 ,  B23K37/04

Abstract: An ingot splitting method and an ingot splitting apparatus are provided. The ingot splitting method includes the following steps. A laser provided from a laser source is focused with a focusing lens group on a plane to be split of an ingot, and a focus point of the laser is used to scan the plane to be split. An opposing first side and second side of the ingot are fixed with a chuck table and an ultrasonic source. The plane to be split is located between the first side and the second side. A pulling force is applied to the second side in a direction away from the ingot with a tensioner, and ultrasonic waves are applied to vibrate the ingot with the ultrasonic source simultaneously, so that the ingot is divided into two parts from the plane to be split.