公开(公告)号：US10366946B2

公开(公告)日：2019-07-30

申请号：US15797297

申请日：2017-10-30

Applicant: Infineon Technologies AG

Inventor： Wu Hu Li ,  Edmund Riedl ,  Thomas Horedt ,  Ali Mazloum-Nejadari

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/14 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

Abstract: A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.