公开(公告)号：US11798874B2

公开(公告)日：2023-10-24

申请号：US17456806

申请日：2021-11-29

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Francesca Arcioni ,  Tuncay Erdoel ,  Vincenzo Fiore ,  Helmut Kollmann ,  Arif Roni ,  Emanuele Stavagna ,  Christoph Wagner

IPC: H01L23/52 ,  H01L23/552 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/66 ,  H01L24/08 ,  H01L24/16 ,  H01L2223/6627 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/16238 ,  H01L2924/3025

Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.