公开(公告)号：US11824019B2

公开(公告)日：2023-11-21

申请号：US17356831

申请日：2021-06-24

Applicant: Infineon Technologies AG

Inventor： Tuncay Erdoel ,  Walter Hartner ,  Ulrich Moeller ,  Bernhard Rieder ,  Ernst Seler ,  Maciej Wojnowski

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01P3/12 ,  G01S13/02

CPC classification number: H01L23/66 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01P3/121 ,  H01Q1/2283 ,  G01S13/02 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

公开(公告)号：US12040543B2

公开(公告)日：2024-07-16

申请号：US17648730

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Tuncay Erdoel ,  Klaus Elian ,  Christian Geissler ,  Bernhard Rieder ,  Rainer Markus Schaller ,  Horst Theuss ,  Maciej Wojnowski

IPC: H01Q13/06 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q23/00

CPC classification number: H01Q13/06 ,  H01Q1/2283 ,  H01Q1/526 ,  H01Q23/00

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

公开(公告)号：US11798874B2

公开(公告)日：2023-10-24

申请号：US17456806

申请日：2021-11-29

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Francesca Arcioni ,  Tuncay Erdoel ,  Vincenzo Fiore ,  Helmut Kollmann ,  Arif Roni ,  Emanuele Stavagna ,  Christoph Wagner

IPC: H01L23/52 ,  H01L23/552 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/66 ,  H01L24/08 ,  H01L24/16 ,  H01L2223/6627 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/16238 ,  H01L2924/3025

Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.

公开(公告)号：US11872853B2

公开(公告)日：2024-01-16

申请号：US17335458

申请日：2021-06-01

Applicant: Infineon Technologies AG

Inventor： Michael Kandler ,  Thomas Engl ,  Tuncay Erdoel ,  Maximilian Werner ,  Maciej Wojnowski

IPC: B60C23/04 ,  B60C11/24

CPC classification number: B60C23/0444 ,  B60C23/0416 ,  B60C11/246

Abstract: A tire pressure monitoring system (TPMS) includes a communication interface device configured to communicate with a target TPMS sensor module. The communication interface device include a radio frequency (RF) transceiver configured to generate at least one wake-up signal; an antenna array configured to transmit each wake-up signal as a directional RF beam; a processing circuit configured to monitor for a response signal in response to the antenna array transmitting the at least one wake-up signal; and a power amplifier configured to set a power of each wake-up signal according to an adjustable power setting such that the power of each subsequent wake-up signal is increased in discrete steps until the response signal is received by the RF transceiver.