Semiconductor device with latchup immunity

    公开(公告)号:US10957792B2

    公开(公告)日:2021-03-23

    申请号:US16103160

    申请日:2018-08-14

    摘要: A semiconductor device includes a body region of a second conductivity type, a body contact region of the second conductivity type formed in the body region and having a higher average doping concentration than the body region, a source region of a first conductivity type opposite the second conductivity type formed in the body region adjacent the body contact region, a drift zone of the first conductivity type spaced apart from the source region by a section of the body region which forms a channel region of the semiconductor device, and a gate electrode configured to control the channel region. The body contact region extends under a majority of the source region in a direction towards the channel region and has a doping concentration of at least 1e18 cm−3 under the majority of the source region. Additional semiconductor device embodiments and methods of manufacture are described.

    Semiconductor Device with Latchup Immunity
    2.
    发明申请

    公开(公告)号:US20200058787A1

    公开(公告)日:2020-02-20

    申请号:US16103160

    申请日:2018-08-14

    摘要: A semiconductor device includes a body region of a second conductivity type, a body contact region of the second conductivity type formed in the body region and having a higher average doping concentration than the body region, a source region of a first conductivity type opposite the second conductivity type formed in the body region adjacent the body contact region, a drift zone of the first conductivity type spaced apart from the source region by a section of the body region which forms a channel region of the semiconductor device, and a gate electrode configured to control the channel region. The body contact region extends under a majority of the source region in a direction towards the channel region and has a doping concentration of at least 1e18 cm−3 under the majority of the source region, Additional semiconductor device embodiments and methods of manufacture are described.