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公开(公告)号:US10957792B2
公开(公告)日:2021-03-23
申请号:US16103160
申请日:2018-08-14
发明人: Chi Dong Nguyen , Andreas Rupp
IPC分类号: H01L29/78 , H01L21/225 , H01L21/265 , H01L21/266 , H01L29/08 , H01L29/10 , H01L29/66
摘要: A semiconductor device includes a body region of a second conductivity type, a body contact region of the second conductivity type formed in the body region and having a higher average doping concentration than the body region, a source region of a first conductivity type opposite the second conductivity type formed in the body region adjacent the body contact region, a drift zone of the first conductivity type spaced apart from the source region by a section of the body region which forms a channel region of the semiconductor device, and a gate electrode configured to control the channel region. The body contact region extends under a majority of the source region in a direction towards the channel region and has a doping concentration of at least 1e18 cm−3 under the majority of the source region. Additional semiconductor device embodiments and methods of manufacture are described.
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公开(公告)号:US20200058787A1
公开(公告)日:2020-02-20
申请号:US16103160
申请日:2018-08-14
发明人: Chi Dong Nguyen , Andreas Rupp
IPC分类号: H01L29/78 , H01L29/10 , H01L29/08 , H01L29/66 , H01L21/265 , H01L21/266 , H01L21/225
摘要: A semiconductor device includes a body region of a second conductivity type, a body contact region of the second conductivity type formed in the body region and having a higher average doping concentration than the body region, a source region of a first conductivity type opposite the second conductivity type formed in the body region adjacent the body contact region, a drift zone of the first conductivity type spaced apart from the source region by a section of the body region which forms a channel region of the semiconductor device, and a gate electrode configured to control the channel region. The body contact region extends under a majority of the source region in a direction towards the channel region and has a doping concentration of at least 1e18 cm−3 under the majority of the source region, Additional semiconductor device embodiments and methods of manufacture are described.
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