公开(公告)号：US20150001700A1

公开(公告)日：2015-01-01

申请号：US13930607

申请日：2013-06-28

Applicant: Infineon Technologies AG

Inventor： Hans Hartung ,  Johannes Uhlig ,  Christian Domesle

IPC: H01L23/00 ,  H01L23/29 ,  H01L21/56

CPC classification number: H01L23/564 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3135 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/206

Abstract: A module includes a base plate, a substrate having a first metallized side attached to the base plate and an opposing second metallized side, a power semiconductor die attached to the second metallized side of the substrate at a first side of the die, a first plurality of electrical connections between the second metallized side of the substrate and a second side of the die opposing the first side of the die, and a housing attached to a periphery of the base plate. The housing and base plate enclose the die and the first electrical connections. A second plurality of electrical connections extend from the second metallized side of the substrate through the housing to provide external electrical connections for the module. A parylene coating prevents gases and humidity from reaching the die, the first electrical connections, and the first metallized side of the substrate.

Abstract translation: 模块包括基板，具有附接到基板的第一金属化侧的基板和相对的第二金属化侧，在模具的第一侧附接到基板的第二金属化侧的功率半导体管芯，第一多个 在基板的第二金属化侧和与模具的第一侧相对的模具的第二侧之间的电连接以及附接到基板的周边的壳体。 外壳和底板封装模具和第一电气连接。 第二多个电连接从衬底的第二金属化侧通过壳体延伸以提供用于模块的外部电连接。 聚对二甲苯涂层防止气体和湿度到达模具，第一电连接和基板的第一金属化侧。