公开(公告)号：US10223629B2

公开(公告)日：2019-03-05

申请号：US15726417

申请日：2017-10-06

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Peter Stampka ,  Mathias Belzner ,  Ralph Domnick ,  Daniel Weiss

IPC: G06K19/06 ,  G06K19/07 ,  G06K19/077 ,  H01L23/498

Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.

公开(公告)号：US20190033206A1

公开(公告)日：2019-01-31

申请号：US16043824

申请日：2018-07-24

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Mathias Belzner ,  Ralph Domnick ,  Jens Pohl ,  Frank Pueschner ,  Peter Stampka ,  Daniel Weiss

IPC: G01N21/25 ,  G02B5/08 ,  G06K19/06 ,  G06K19/07

CPC classification number: G01N21/255 ,  B42D25/305 ,  B42D25/324 ,  B42D25/351 ,  B42D25/36 ,  B42D25/373 ,  G01N21/251 ,  G02B5/0875 ,  G06K19/06009 ,  G06K19/06028 ,  G06K19/06037 ,  G06K19/07 ,  G06K19/0723

Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.

公开(公告)号：US10585034B2

公开(公告)日：2020-03-10

申请号：US16043824

申请日：2018-07-24

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Mathias Belzner ,  Ralph Domnick ,  Jens Pohl ,  Frank Pueschner ,  Peter Stampka ,  Daniel Weiss

IPC: G01N21/25 ,  G02B5/08 ,  G06K19/06 ,  G06K19/07 ,  B42D25/324 ,  B42D25/305 ,  B42D25/36 ,  B42D25/351 ,  B42D25/373

Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.

公开(公告)号：US20180101758A1

公开(公告)日：2018-04-12

申请号：US15726417

申请日：2017-10-06

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Peter Stampka ,  Mathias Belzner ,  Ralph Domnick ,  Daniel Weiss

IPC: G06K19/07 ,  H01L23/498 ,  G06K19/077

CPC classification number: G06K19/0723 ,  G06K19/02 ,  G06K19/07718 ,  G06K19/10 ,  H01L23/49855

Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.