公开(公告)号：US20230021853A1

公开(公告)日：2023-01-26

申请号：US17866777

申请日：2022-07-18

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Jens Pohl ,  Uwe Wagner ,  Thomas Spoettl

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  B42D25/305

Abstract: A method for producing a document structure, wherein the method includes producing a chip structure by forming a cavity in a carrier having a top side and an under side, picking up a chip having at least one chip contact and a redistribution layer (RDL) connected to the at least one chip contact by means of a picking-up device detaching the chip from an auxiliary carrier, wherein the chip bears on the auxiliary carrier by way of the RDL, wherein the chip is lifted up from the auxiliary carrier by means of pressure being exerted on the RDL, wherein the lifted-up chip is picked up and inserted into the cavity, and wherein the RDL is oriented on the top side of the carrier, fixing the chip in the cavity by means of an adhesive, electrically conductively connecting the at least one chip contact of the RDL to an electrically conductive region of the carrier by means of an electrically conductive material, and embedding the carrier between a first paper layer and a second paper layer.

公开(公告)号：US09935042B2

公开(公告)日：2018-04-03

申请号：US15609136

申请日：2017-05-31

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Guenther Ruhl ,  Peter Stampka

IPC: H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01L23/367 ,  H01L23/495 ,  G06K19/07 ,  G06K19/077 ,  H05K1/11 ,  H01L23/00 ,  H01L23/34

CPC classification number: H01L23/498 ,  G06K19/072 ,  G06K19/07309 ,  G06K19/077 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/573 ,  H01L24/73 ,  H01L25/0657 ,  H05K1/113

Abstract: A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

公开(公告)号：US20170345740A1

公开(公告)日：2017-11-30

申请号：US15609136

申请日：2017-05-31

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Guenther Ruhl ,  Peter Stampka

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/495 ,  H01L23/367 ,  H01L23/34 ,  G06K19/077 ,  H05K1/11 ,  G06K19/07

CPC classification number: H01L23/498 ,  G06K19/072 ,  G06K19/07309 ,  G06K19/077 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/573 ,  H01L24/73 ,  H01L25/0657 ,  H05K1/113

Abstract: A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

公开(公告)号：US09384437B2

公开(公告)日：2016-07-05

申请号：US14697664

申请日：2015-04-28

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Thomas Spoettl ,  Jens Pohl ,  Gottfried Beer

IPC: G06K19/06 ,  G06K19/077 ,  G06K19/07 ,  H01L25/00 ,  H01L23/488 ,  H01L21/48

CPC classification number: G06K19/07705 ,  G06K19/0716 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07754 ,  H01L21/48 ,  H01L23/488 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16238

Abstract: In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.

公开(公告)号：USD967036S1

公开(公告)日：2022-10-18

申请号：US29729221

申请日：2020-03-25

Applicant: Infineon Technologies AG

Designer： Roman Hollweck ,  Thomas Lehmann ,  Jens Pohl ,  Frank Pueschner ,  Thomas Spoettl

公开(公告)号：US20210345683A1

公开(公告)日：2021-11-11

申请号：US17307367

申请日：2021-05-04

Applicant: Infineon Technologies AG

Inventor： Jens Pohl ,  Thea Goetz ,  Frank Pueschner ,  Thomas Spoettl

IPC: A24F40/53 ,  A24F40/10 ,  A24F40/65 ,  A24F40/70

Abstract: An electronic inhalation apparatus including a body having a chip module accommodating region which is at least partially surrounded by a folding structure which, when a chip module is accommodated in the chip module accommodating region, is bent around the chip module in order to fasten the chip module.

公开(公告)号：US10395157B2

公开(公告)日：2019-08-27

申请号：US14483174

申请日：2014-09-11

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Thomas Spoettl ,  Jens Pohl ,  Peter Stampka

IPC: H01L21/56 ,  G06K19/077 ,  H01L23/00 ,  H01L23/31

Abstract: A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

公开(公告)号：US20220240593A1

公开(公告)日：2022-08-04

申请号：US17592848

申请日：2022-02-04

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Josef Gruber ,  Bala Nagendra Raja Munjuluri ,  Walther Pachler ,  Jens Pohl ,  Thomas Spoettl

IPC: A24F40/65 ,  A24F40/57

Abstract: A device for an electronic cigarette. The device includes an enveloping element defining an interior, and an authentication device arranged in or on the enveloping element. The authentication device includes a planar loop antenna, and an authentication logic coupled to the planar loop antenna and configured to provide an authentication of the device vis-à-vis a control element of the electronic cigarette. The planar loop antenna is arranged in rolled form in the interior of the enveloping element or on the exterior of the enveloping element. The loop antenna comprises conduction sections in two opposite regions of the planar loop antenna, which extend in the longitudinal direction of the rolled loop antenna. The conduction sections of the opposite regions are arranged such that they are adjacent or overlap one another, with a result that their respective fields mutually compensate for one another at least partly.

公开(公告)号：US10157848B2

公开(公告)日：2018-12-18

申请号：US14882524

申请日：2015-10-14

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Jens Pohl ,  Thomas Spoettl ,  Peter Stampka

IPC: H01L23/495 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  G06K19/07 ,  G06K19/077

Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

公开(公告)号：US10114992B2

公开(公告)日：2018-10-30

申请号：US15644863

申请日：2017-07-10

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Jens Pohl ,  Thomas Spoettl ,  Peter Stampka

IPC: G06K5/00 ,  G06K7/10

Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.