公开(公告)号：US20230350309A1

公开(公告)日：2023-11-02

申请号：US18137131

申请日：2023-04-20

Applicant: Infineon Technologies AG

Inventor： Detlef Hofmann ,  Heiko Aßmann

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/311 ,  H01L21/033

CPC classification number: G03F7/70541 ,  H01L21/0275 ,  H01L21/31144 ,  H01L21/0337

Abstract: A method of generating chip-specific identification code marks on semiconductor chips includes patterning a resist layer over a semiconductor wafer by laser direct image exposure, the patterning including writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer. The patterned resist layer is then developed.