公开(公告)号：US10607911B2

公开(公告)日：2020-03-31

申请号：US14997596

申请日：2016-01-18

Applicant: Infineon Technologies AG

Inventor： Martin Richard Niessner ,  Walter Hartner ,  Gerhard Haubner ,  Sebastian Pahlke

IPC: H05K7/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/52 ,  H05K1/02 ,  H05K1/18 ,  H01L23/14 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00

Abstract: A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.

公开(公告)号：US10916484B2

公开(公告)日：2021-02-09

申请号：US16014745

申请日：2018-06-21

Applicant: Infineon Technologies AG

Inventor： Robert Fehler ,  Francesca Arcioni ,  Christian Geissler ,  Walter Hartner ,  Gerhard Haubner ,  Thorsten Meyer ,  Martin Richard Niessner ,  Maciej Wojnowski

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/683 ,  H01L23/538 ,  H01L21/56

Abstract: An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.

公开(公告)号：US20180374769A1

公开(公告)日：2018-12-27

申请号：US16014745

申请日：2018-06-21

Applicant: Infineon Technologies AG

Inventor： Robert Fehler ,  Francesca Arcioni ,  Christian Geissler ,  Walter Hartner ,  Gerhard Haubner ,  Thorsten Meyer ,  Martin Richard Niessner ,  Maciej Wojnowski

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.