公开(公告)号：US20150009052A1

公开(公告)日：2015-01-08

申请号：US13934554

申请日：2013-07-03

Applicant: Infineon Technologies AG

Inventor： Peter BOGNER ,  Jaafar MEJRI

IPC: H03M1/10 ,  G01R31/28

CPC classification number: H03M1/1071 ,  G01R31/2884 ,  H03M1/12

Abstract: A semiconductor chip with a built-in-self-test circuit including a first analog-to-digital converter (ADC) configured to convert an analog input voltage signal received at its input into a digital output voltage signal that characterizes the first ADC; and a second ADC coupled to the input of the first ADC and configured to convert the analog input voltage signal received at its input to a digital feedback voltage signal, wherein the analog input voltage signal is generated based on the digital feedback signal.

Abstract translation: 一种具有内置自测电路的半导体芯片，包括：第一模数转换器（ADC），被配置为将其输入端接收的模拟输入电压信号转换成表征第一ADC的数字输出电压信号; 以及耦合到所述第一ADC的输入并被配置为将在其输入处接收的模拟输入电压信号转换为数字反馈电压信号的第二ADC，其中所述模拟输入电压信号是基于所述数字反馈信号产生的。