公开(公告)号：US20250079275A1

公开(公告)日：2025-03-06

申请号：US18781582

申请日：2024-07-23

Applicant: Infineon Technologies AG

Inventor： Wolfgang SCHOLZ ,  Marcus BÖHM ,  Bernd Richard SCHMÖLZER ,  Andre Rainer STEGNER ,  Lisa Marie HOLZMANN ,  Thorsten SCHARF

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L25/07

Abstract: A package is disclosed. In one example, the package comprises a carrier, a first chip with an integrated transistor and comprising a first terminal attached on the carrier, a second terminal, and a third terminal, wherein the first terminal and the third terminal are formed on one main surface of the first chip and the second terminal is formed on an opposing other main surface of the first chip. A conductive structure is attached on the second terminal, an encapsulant is at least partially encapsulating the carrier, the first chip, and the conductive structure, and an insulating layer is arranged on a surface portion of the conductive structure or of the carrier. The surface portion is exposed beyond the encapsulant.