公开(公告)号：US20250079275A1

公开(公告)日：2025-03-06

申请号：US18781582

申请日：2024-07-23

Applicant: Infineon Technologies AG

Inventor： Wolfgang SCHOLZ ,  Marcus BÖHM ,  Bernd Richard SCHMÖLZER ,  Andre Rainer STEGNER ,  Lisa Marie HOLZMANN ,  Thorsten SCHARF

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L25/07

Abstract: A package is disclosed. In one example, the package comprises a carrier, a first chip with an integrated transistor and comprising a first terminal attached on the carrier, a second terminal, and a third terminal, wherein the first terminal and the third terminal are formed on one main surface of the first chip and the second terminal is formed on an opposing other main surface of the first chip. A conductive structure is attached on the second terminal, an encapsulant is at least partially encapsulating the carrier, the first chip, and the conductive structure, and an insulating layer is arranged on a surface portion of the conductive structure or of the carrier. The surface portion is exposed beyond the encapsulant.

公开(公告)号：US20230361009A1

公开(公告)日：2023-11-09

申请号：US18195178

申请日：2023-05-09

Applicant: Infineon Technologies AG

Inventor： Lee Shuang WANG ,  Marta ALOMAR DOMINGUEZ ,  Marcus BÖHM ,  Edward FÜRGUT ,  Chii Shang HONG ,  Teck Sim LEE ,  Bernd SCHMOELZER

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07

CPC classification number: H01L23/49562 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/40175

Abstract: A semiconductor package is disclosed. In one example, the semiconductor package comprises a package body and a second die pad at least partially encapsulated in the package body. A first semiconductor die is at least partially encapsulated in the package body and arranged on the first die pad. A further device at least partially encapsulated in the package body and arranged on the second die pad. At least one first lead is connected with the first contact pad of the first semiconductor die. At least one second lead is connected with the second contact pad of the further device. An electrical conductor is connected between the at least one first lead and the at least one second lead, the electrical conductor being completely encapsulated in the package body.