公开(公告)号：US11316292B2

公开(公告)日：2022-04-26

申请号：US16673401

申请日：2019-11-04

Applicant: Infineon Technologies AG

Inventor： Tomas Manuel Reiter ,  Mark Nils Muenzer ,  Marco Stallmeister

IPC: H01R13/05 ,  H01L23/538 ,  H01L23/00 ,  H01R13/24

Abstract: A semiconductor power module includes an electrically conductive carrier plate, a power semiconductor chip arranged on the carrier plate and electrically connected to the carrier plate, and a contact pin electrically connected to the carrier plate and forming an outer contact of the semiconductor power module. The contact pin is arranged above a soldering point. The soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect the contact pin to the carrier plate. The contact pin is electrically connected to the carrier plate via a further connection. The further connection has a portion which is mechanically flexible in relation to the carrier plate.

公开(公告)号：US20200153138A1

公开(公告)日：2020-05-14

申请号：US16673401

申请日：2019-11-04

Applicant: Infineon Technologies AG

Inventor： Tomas Manuel Reiter ,  Mark Nils Muenzer ,  Marco Stallmeister

IPC: H01R13/05 ,  H01L23/538 ,  H01R13/24 ,  H01L23/00

Abstract: A semiconductor power module includes an electrically conductive carrier plate, a power semiconductor chip arranged on the carrier plate and electrically connected to the carrier plate, and a contact pin electrically connected to the carrier plate and forming an outer contact of the semiconductor power module. The contact pin is arranged above a soldering point. The soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect the contact pin to the carrier plate. The contact pin is electrically connected to the carrier plate via a further connection. The further connection has a portion which is mechanically flexible in relation to the carrier plate.