公开(公告)号：US20240203935A1

公开(公告)日：2024-06-20

申请号：US18528237

申请日：2023-12-04

Applicant: Infineon Technologies AG

Inventor： Toni SALMINEN ,  Mahadi-Ul HASSAN ,  Nagarajan PALAVESAM

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/82 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L2224/19 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/24155 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/82106 ,  H01L2924/01013 ,  H01L2924/01029

Abstract: A method of embedding a bare die in a carrier laminate is provided. The method includes providing the bare die including a metal layer on a front side of the bare die or on a back side of the bare die opposite the front side. A layer is formed over the metal layer. The bare die is mounted in a recess of the carrier laminate with the layer facing an opening of the recess. The recess is filled with a dielectric material. A portion of the dielectric material that is on the layer is removed. A metal structure is deposited over at least a portion of the layer and at least a portion of the carrier laminate.