公开(公告)号：US20240203935A1

公开(公告)日：2024-06-20

申请号：US18528237

申请日：2023-12-04

Applicant: Infineon Technologies AG

Inventor： Toni SALMINEN ,  Mahadi-Ul HASSAN ,  Nagarajan PALAVESAM

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/82 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L2224/19 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/24155 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/82106 ,  H01L2924/01013 ,  H01L2924/01029

Abstract: A method of embedding a bare die in a carrier laminate is provided. The method includes providing the bare die including a metal layer on a front side of the bare die or on a back side of the bare die opposite the front side. A layer is formed over the metal layer. The bare die is mounted in a recess of the carrier laminate with the layer facing an opening of the recess. The recess is filled with a dielectric material. A portion of the dielectric material that is on the layer is removed. A metal structure is deposited over at least a portion of the layer and at least a portion of the carrier laminate.

公开(公告)号：US20160113127A1

公开(公告)日：2016-04-21

申请号：US14882678

申请日：2015-10-14

Applicant: Infineon Technologies AG

Inventor： Toni SALMINEN ,  Markus DINKEL

IPC: H05K5/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

Abstract: Electronic module comprising at least one electronic chip, an encapsulation structure in which the at least one electronic chip is at least partially encapsulated, an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip, and an electrically insulating structure which is at least partially formed from a material having a low modulus of elasticity, wherein a variation of the value of the modulus of elasticity is at the most 10 GPa in a temperature range between −40° C. and +150° C.

Abstract translation: 电子模块包括至少一个电子芯片，其中所述至少一个电子芯片至少部分地被封装的封装结构，用于所述至少一个电子芯片的导电接触的导电结构，以及电绝缘结构， 至少部分地由具有低弹性模量的材料形成，其中在-40℃和+ 150℃之间的温度范围内弹性模量值的变化值最多为10GPa。