公开(公告)号：US20220278026A1

公开(公告)日：2022-09-01

申请号：US17680409

申请日：2022-02-25

Applicant: Infineon Technologies AG

Inventor： Andre Wedi ,  Tobias Buehner ,  Alexander Ciliox ,  Peter Lahl

IPC: H01L23/492 ,  H01L21/48 ,  H01L23/15 ,  H01L23/00

Abstract: A method for fabricating a substrate comprising a solder stop structure comprises providing a substrate configured to carry a surface mounted device, the substrate comprising a ceramic layer and a metallization arranged on the ceramic layer, wherein the metallization comprises a base metal layer and a noble metal layer covering the base metal layer, and generating an oxidation structure on the metallization, wherein the oxidation structure divides the metallization into a first part and a second part, and wherein the oxidation structure is configured to act as a solder stop, wherein generating the oxidation structure comprises partially removing the noble metal layer.