公开(公告)号：US20220278026A1

公开(公告)日：2022-09-01

申请号：US17680409

申请日：2022-02-25

Applicant: Infineon Technologies AG

Inventor： Andre Wedi ,  Tobias Buehner ,  Alexander Ciliox ,  Peter Lahl

IPC: H01L23/492 ,  H01L21/48 ,  H01L23/15 ,  H01L23/00

Abstract: A method for fabricating a substrate comprising a solder stop structure comprises providing a substrate configured to carry a surface mounted device, the substrate comprising a ceramic layer and a metallization arranged on the ceramic layer, wherein the metallization comprises a base metal layer and a noble metal layer covering the base metal layer, and generating an oxidation structure on the metallization, wherein the oxidation structure divides the metallization into a first part and a second part, and wherein the oxidation structure is configured to act as a solder stop, wherein generating the oxidation structure comprises partially removing the noble metal layer.

公开(公告)号：US20250047049A1

公开(公告)日：2025-02-06

申请号：US18786666

申请日：2024-07-29

Applicant: Infineon Technologies AG

Inventor： Guido Strotmann ,  Alexander Ciliox

IPC: H01R43/02 ,  B23K9/00 ,  B23K15/00 ,  B23K26/324 ,  B23K37/04 ,  B23K101/40 ,  H01L23/373

Abstract: A method for connecting two connection partners includes: moving a second connection partner towards a first connection partner and simultaneously heating a first section of the second connection partner to soften the first section; and placing the second connection partner on the first connection partner such that the softened first section of the second connection partner directly contacts the first connection partner.

公开(公告)号：US20150257280A1

公开(公告)日：2015-09-10

申请号：US14639635

申请日：2015-03-05

Applicant: Infineon Technologies AG

Inventor： Alexander Ciliox ,  Nicolas Heuck ,  Christian Stahlhut

IPC: H05K3/34 ,  B23K35/02 ,  B23K1/00 ,  B23K31/02 ,  B05D3/02 ,  B05D5/00

CPC classification number: H05K3/3484 ,  B05D3/0254 ,  B05D5/00 ,  B23K1/0016 ,  B23K1/005 ,  B23K1/008 ,  B23K1/20 ,  B23K31/02 ,  B23K35/02 ,  B23K35/0238 ,  B23K35/025 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75501 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K3/1283 ,  H05K3/341 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/111 ,  H05K2203/1545 ,  H01L2924/00

Abstract: One aspect of the invention relates to producing a dried paste layer on a joining partner. For this purpose, a joining partner having a contact surface is provided, to which contact surface a paste is applied. Furthermore, a heating device is provided, which is preheated to a preheating temperature. The paste applied to the contact surface is then dried during a drying phase, such that a dried paste layer arises from the paste. In the drying phase, the joining partner and the preheated heating device are at a distance of at most 5 mm.

Abstract translation: 本发明的一个方面涉及在接合配偶体上制备干糊层。 为此，提供具有接触表面的接合对象，其上施加有粘合剂的接触表面。 此外，提供加热装置，其被预热到预热温度。 然后将施加到接触表面的糊剂在干燥阶段中干燥，从而使糊状物从糊状物产生。 在干燥阶段，接合对象和预热加热装置的距离最大为5mm。