公开(公告)号：US12063474B2

公开(公告)日：2024-08-13

申请号：US17660239

申请日：2022-04-22

Applicant: Infineon Technologies AG

Inventor： Paul Westmarland ,  Bernd Goller ,  Scott Palmer ,  Mark Pavier

IPC: H04R19/04 ,  H04R7/06 ,  H04R7/18

CPC classification number: H04R19/04 ,  H04R7/06 ,  H04R7/18 ,  H04R2201/003 ,  H04R2307/025

Abstract: A sound transducer device includes a multilayer component board having a first side and an opposite second side, and a sound port extending between the first and second sides of the multilayer component board. The sound transducer also includes a MEMS sound transducer die including a suspended membrane structure, wherein the MEMS sound transducer die is arranged at the first side of the multilayer component board such that the suspended membrane structure is in fluid communication with the sound port. The sound transducer also includes a mesh structure for providing an environmental barrier, the mesh structure covering the sound port from either one of the first and second sides of the multilayer component board.

公开(公告)号：US20220369042A1

公开(公告)日：2022-11-17

申请号：US17660239

申请日：2022-04-22

Applicant: Infineon Technologies AG

Inventor： Paul Westmarland ,  Bernd Goller ,  Scott Palmer ,  Mark Pavier

IPC: H04R19/04 ,  H04R7/18 ,  H04R7/06

Abstract: A sound transducer device includes a multilayer component board having a first side and an opposite second side, and a sound port extending between the first and second sides of the multilayer component board. The sound transducer also includes a MEMS sound transducer die including a suspended membrane structure, wherein the MEMS sound transducer die is arranged at the first side of the multilayer component board such that the suspended membrane structure is in fluid communication with the sound port. The sound transducer also includes a mesh structure for providing an environmental barrier, the mesh structure covering the sound port from either one of the first and second sides of the multilayer component board.