公开(公告)号：US20240258372A1

公开(公告)日：2024-08-01

申请号：US18518846

申请日：2023-11-24

Applicant: Infineon Technologies AG

Inventor： Sebastian POLSTER ,  Alexander HEINRICH ,  Martin Richard NIESSNER

IPC: H01L29/06 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L29/0657 ,  H01L21/78 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L29/1608 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/3201 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/8382 ,  H01L2924/10156 ,  H01L2924/10272

Abstract: An electronic component is disclosed. The electronic component comprises a semiconductor body, an active region in a central portion of the semiconductor body, and a stress release structure for releasing stress and being formed as a lateral edge portion of the semiconductor body. The lateral edge portion has a minimum thickness of not more than 40% of a maximum thickness of the semiconductor body.