公开(公告)号：US12270850B2

公开(公告)日：2025-04-08

申请号：US18119076

申请日：2023-03-08

Applicant: Infineon Technologies AG

Inventor： Soon Lai Kho ,  Nee Wan Khoo

IPC: G01R31/26

Abstract: A method includes providing a semiconductor package including an encapsulant body and a plurality of leads that protrude out from the encapsulant body; providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender; arranging the semiconductor package within the package holder; actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender; and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.

公开(公告)号：US12282060B2

公开(公告)日：2025-04-22

申请号：US18119921

申请日：2023-03-10

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Soon Lai Kho

IPC: G01R31/28 ,  G01R1/073 ,  G01R3/00

Abstract: An apparatus for testing semiconductor devices is disclosed. In one example, the apparatus includes a rolling contactor comprising a first cylindrical rotatable holder, a plurality of test pin sets, each one of the test pin sets being connected to the cylindrical rotatable holder. Each one of the test pin sets comprises a plurality of test pins, and a substrate configured to support a plurality of semiconductor devices. The semiconductor devices comprising one or more contact elements on a main surface thereof remote from the substrate, wherein the first cylindrical rotatable holder and the substrate are arranged relative to each other so that due to a rotating movement of the first cylindrical rotatable holder the test pins of the test pin sets are successively contacted with the contact elements of the semiconductor devices.

公开(公告)号：US20240302426A1

公开(公告)日：2024-09-12

申请号：US18119076

申请日：2023-03-08

Applicant: Infineon Technologies AG

Inventor： Soon Lai Kho ,  Nee Wan Khoo

IPC: G01R31/26

CPC classification number: G01R31/2601

Abstract: A method includes providing a semiconductor package comprising an encapsulant body and a plurality of leads that protrude out from the encapsulant body, providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender, arranging the semiconductor package within the package holder, actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender, and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.