公开(公告)号：US11616032B2

公开(公告)日：2023-03-28

申请号：US17152988

申请日：2021-01-20

Applicant: Infineon Technologies AG

Inventor： Daniel Maurer ,  Christof Altstaetter ,  Thomas Beyreder ,  Oliver Blank ,  Jürgen Bostjancic ,  Andreas Kleinbichler ,  Josef Liegl ,  Nicole Schulze-Ollmert

IPC: H01L23/00 ,  G01R31/28

Abstract: A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.

公开(公告)号：US20210242148A1

公开(公告)日：2021-08-05

申请号：US17152988

申请日：2021-01-20

Applicant: Infineon Technologies AG

Inventor： Daniel Maurer ,  Christof Altstaetter ,  Thomas Beyreder ,  Oliver Blank ,  Jürgen Bostjancic ,  Andreas Kleinbichler ,  Josef Liegl ,  Nicole Schulze-Ollmert

IPC: H01L23/00 ,  G01R31/28

Abstract: A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.