公开(公告)号：US10229891B2

公开(公告)日：2019-03-12

申请号：US15436778

申请日：2017-02-18

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Steffen Jordan ,  Wolfgang Schober ,  Thomas Ziegler

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/538 ,  H01L23/498

Abstract: A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.

公开(公告)号：US20170250152A1

公开(公告)日：2017-08-31

申请号：US15436778

申请日：2017-02-18

Applicant: Infineon Technologies AG

Inventor： Thorsten SCHARF ,  Steffen Jordan ,  Wolfgang Schober ,  Thomas Ziegler

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L24/08 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/03 ,  H01L24/06 ,  H01L24/17 ,  H01L24/43 ,  H01L24/45 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/18 ,  H01L2924/01015

Abstract: A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.