专利检索 ap:("Infineon Technologies Austria AG") AND inv:"Peter Eibl" 第 1 页

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发明申请
Electronic Module Comprising a Semiconductor Package with Integrated Clip and Fastening Element 审中-公开

公开(公告)号：US20200294885A1

公开(公告)日：2020-09-17

申请号：US16816561

申请日：2020-03-12

申请人： Infineon Technologies Austria AG

发明人： Edward Fuergut , Peter Eibl , Horst Groeninger , Martin Gruber , Christian Kasztelan , Philipp Seng

IPC分类号： H01L23/40 , H01L23/495 , H01L23/00 , H01L21/56 , H01L25/11

摘要： An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.