-
公开(公告)号：US09922910B2
公开(公告)日：2018-03-20
申请号：US15272037
申请日：2016-09-21
发明人： Ralf Otremba , Edward Fuergut , Christian Kasztelan , Hsieh Ting Kuek , Teck Sim Lee , Sanjay Kumar Murugan , Lee Shuang Wang
CPC分类号： H01L23/49568 , H01L21/4825 , H01L21/4882 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/4006 , H01L23/4093 , H01L23/49562 , H01L23/49575 , H01L2224/48091 , H01L2924/15159 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.
-
公开(公告)号：US09837288B2
公开(公告)日：2017-12-05
申请号：US15170175
申请日：2016-06-01
IPC分类号： H01L23/10 , H01L21/56 , H01L23/00 , H01L25/07 , H01L23/36 , H01L23/373 , H01L23/495 , H01L23/498 , H01L23/24 , H01L23/40
CPC分类号： H01L21/565 , H01L23/24 , H01L23/36 , H01L23/3737 , H01L23/4006 , H01L23/4093 , H01L23/49524 , H01L23/49562 , H01L23/49861 , H01L24/48 , H01L25/074 , H01L2224/45099 , H01L2224/4846 , H01L2225/06589 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor power package includes a pre-molded chip housing and an electrically conducting chip carrier cast-in-place in the pre-molded chip housing. The semiconductor power package further includes a power semiconductor chip bonded on the electrically conducting chip carrier. A covering material is provided to embed the power semiconductor chip. The covering material has an elastic modulus less than an elastic modulus of a material of the pre-molded chip housing and/or a thermal conductivity greater than a thermal conductivity of the material of the pre-molded chip housing and/or a temperature stability greater than a temperature stability of the pre-molded chip housing.
-
公开(公告)号：US20230395442A1
公开(公告)日：2023-12-07
申请号：US18235104
申请日：2023-08-17
发明人： Christian Kasztelan , Nee Wan Khoo
IPC分类号： H01L23/04 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/495
CPC分类号： H01L23/041 , H01L21/56 , H01L23/3107 , H01L23/367 , H01L23/495
摘要： A method of manufacturing a package includes mounting an electronic component on an electrically conductive carrier, encapsulating part of the carrier and the electronic component by an encapsulant, covering an exposed surface portion of the carrier with an electrically insulating and thermally conductive interface structure, and covering at least part of the interface structure by a protection cap.
-
公开(公告)号：US11276680B2
公开(公告)日：2022-03-15
申请号：US14920374
申请日：2015-10-22
发明人： Daniel Pedone , Hans-Joachim Schulze , Rolf Gerlach , Christian Kasztelan , Anton Mauder , Hubert Rothleitner , Wolfgang Scholz , Philipp Seng , Peter Tuerkes
IPC分类号： H01L27/02 , H01L27/06 , H01L29/739 , H01L29/866 , H01L21/8249
摘要： A temperature protected power semiconductor device has a substrate which includes a power field effect transistor (FET) and a thermosensitive element. The power FET has a gate electrode connected to a gate, a drift region, and first and second terminals for a load current. The load current is controllable during operation by a voltage applied between the gate and the first terminal. The thermosensitive element has a first contact connected to one of the gate electrode and first terminal of the power FET, and a second contact connected to the other one of the gate electrode and first terminal. The thermosensitive element is located close to the power FET and thermally coupled thereto. The thermosensitive element is configured to cause the power FET to reduce the load current in case of an exceedance of a limit temperature of the power FET, by interconnecting the gate and first terminal.
-
公开(公告)号：US10734250B2
公开(公告)日：2020-08-04
申请号：US16293246
申请日：2019-03-05
IPC分类号： H01L21/50 , H01L21/56 , H01L23/00 , H01L25/07 , H01L23/36 , H01L23/373 , H01L23/40 , H01L23/495 , H01L23/498 , H01L23/24
摘要： A method of manufacturing a semiconductor power package includes: embedding a power semiconductor chip in an encapsulation, the encapsulation forming a housing of the semiconductor power package; and extending a layer of a covering material over at least a part of an outer main surface of the encapsulation. The covering material has a thermal conductivity greater than a thermal conductivity of the material of the encapsulation and/or a temperature stability greater than a temperature stability of the pre-molded chip housing.
-
公开(公告)号：US20180102262A1
公开(公告)日：2018-04-12
申请号：US15829592
申请日：2017-12-01
CPC分类号： H01L21/565 , H01L23/24 , H01L23/36 , H01L23/3737 , H01L23/4006 , H01L23/4093 , H01L23/49524 , H01L23/49562 , H01L23/49861 , H01L24/48 , H01L25/074 , H01L2224/45099 , H01L2224/4846 , H01L2225/06589 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A method of manufacturing a semiconductor power package includes: providing a pre-molded chip housing and an electrically conducting chip carrier cast-in-place in the pre-molded chip housing; bonding a power semiconductor chip on the electrically conducting chip carrier; and applying a covering material so as to embed the power semiconductor chip. The covering material has an elastic modulus less than an elastic modulus of a material of the pre-molded chip housing and/or a thermal conductivity greater than a thermal conductivity of the material of the pre-molded chip housing and/or a temperature stability greater than a temperature stability of the pre-molded chip housing.
-
公开(公告)号：US20170098598A1
公开(公告)日：2017-04-06
申请号：US15272037
申请日：2016-09-21
发明人： Ralf OTREMBA , Edward Fuergut , Christian Kasztelan , Hsieh Ting Kuek , Teck Sim Lee , Sanjay Kumar Nurugan , Lee Shuang Wang
IPC分类号： H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31
CPC分类号： H01L23/49568 , H01L21/4825 , H01L21/4882 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/4006 , H01L23/4093 , H01L23/49562 , H01L23/49575 , H01L2224/48091 , H01L2924/15159 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.
-
公开(公告)号：US11769701B2
公开(公告)日：2023-09-26
申请号：US17175967
申请日：2021-02-15
发明人： Christian Kasztelan , Nee Wan Khoo
IPC分类号： H01L23/367 , H01L23/31 , H01L23/04 , H01L21/56 , H01L23/495
CPC分类号： H01L23/041 , H01L21/56 , H01L23/3107 , H01L23/367 , H01L23/495
摘要： A package includes an electrically conductive carrier, an electronic component on the carrier, an encapsulant encapsulating part of the carrier and the electronic component, an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protection cap covering at least part of the interface structure. Corresponding methods of manufacturing and operating the package are also described.
-
公开(公告)号：US20210272861A1
公开(公告)日：2021-09-02
申请号：US17175967
申请日：2021-02-15
发明人： Christian Kasztelan , Nee Wan Khoo
IPC分类号： H01L23/04 , H01L23/495 , H01L23/31 , H01L21/56 , H01L23/367
摘要： A package includes an electrically conductive carrier, an electronic component on the carrier, an encapsulant encapsulating part of the carrier and the electronic component, an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protection cap covering at least part of the interface structure. Corresponding methods of manufacturing and operating the package are also described.
-
10.发明申请公开(公告)号：US20200294885A1
公开(公告)日：2020-09-17
申请号：US16816561
申请日：2020-03-12
发明人： Edward Fuergut , Peter Eibl , Horst Groeninger , Martin Gruber , Christian Kasztelan , Philipp Seng
IPC分类号： H01L23/40 , H01L23/495 , H01L23/00 , H01L21/56 , H01L25/11
摘要： An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.019 秒)
