公开(公告)号：US20240312936A1

公开(公告)日：2024-09-19

申请号：US18604787

申请日：2024-03-14

申请人： Infineon Technologies Austria AG

发明人： Joon Shyan Tan ,  Lee Shuang Wang ,  Azlina Kassim ,  Teck Sim Lee ,  Kok Yau Chua ,  Chee Hong Lee ,  Zhihui Yuan

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/08 ,  H01L23/3107 ,  H01L23/49838 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/08225 ,  H01L2224/45014 ,  H01L2224/48175 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19101

摘要： A power semiconductor package includes: a first power semiconductor die arranged on and electrically coupled to a first side of a first die pad; a first passive electronic component having a first end and an opposite second end, the first end being arranged on and coupled to the first side of the first die pad and the second end being coupled to an internal ledge of a first external contact; a second passive electronic component connected in series with the first passive electronic component; and an encapsulation encapsulating the first power semiconductor die and the first and second passive electronic components. The first external contact is exposed from a first lateral side of the encapsulation.