公开(公告)号：US10707965B2

公开(公告)日：2020-07-07

申请号：US16241625

申请日：2019-01-07

Applicant: Infinera Corporation

Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Klsh, Jr. ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

IPC: H04B10/40 ,  H04B10/50 ,  G02B6/42 ,  G02B6/35 ,  G02B6/36 ,  H04B10/60 ,  H04J14/06

Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

公开(公告)号：US10211925B2

公开(公告)日：2019-02-19

申请号：US15849390

申请日：2017-12-20

Applicant: Infinera Corporation

Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Kish, Jr. ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

IPC: G02B6/35 ,  G02B6/36 ,  G02B6/42 ,  H04B10/40 ,  H04B10/50 ,  H04J14/06

Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

公开(公告)号：US20180138981A1

公开(公告)日：2018-05-17

申请号：US15849390

申请日：2017-12-20

Applicant: Infinera Corporation

Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Kish ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

IPC: H04B10/40 ,  H04J14/06 ,  H04B10/50 ,  G02B6/42 ,  G02B6/36 ,  G02B6/35

CPC classification number: H04B10/40 ,  G02B6/3584 ,  G02B6/3598 ,  G02B6/366 ,  G02B6/4204 ,  G02B6/4215 ,  G02B6/4234 ,  G02B6/4246 ,  H04B10/503 ,  H04J14/06

Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

公开(公告)号：US09876575B2

公开(公告)日：2018-01-23

申请号：US14699907

申请日：2015-04-29

Applicant: Infinera Corporation

Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Kish, Jr. ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

IPC: H04B10/40 ,  H04J14/06 ,  H04B10/50 ,  G02B6/42 ,  G02B6/35 ,  G02B6/36

CPC classification number: H04B10/40 ,  G02B6/3584 ,  G02B6/3598 ,  G02B6/366 ,  G02B6/4204 ,  G02B6/4215 ,  G02B6/4234 ,  G02B6/4246 ,  H04B10/503 ,  H04J14/06

Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

公开(公告)号：US20190158183A1

公开(公告)日：2019-05-23

申请号：US16241625

申请日：2019-01-07

Applicant: Infinera Corporation

Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Klsh ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

IPC: H04B10/40 ,  H04B10/50 ,  H04J14/06 ,  G02B6/42

Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

公开(公告)号：US20150318952A1

公开(公告)日：2015-11-05

申请号：US14699907

申请日：2015-04-29

Applicant: Infinera Corporation

Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Kish, JR. ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

IPC: H04J14/06 ,  H04B10/40 ,  H04B10/50

CPC classification number: H04B10/40 ,  G02B6/3584 ,  G02B6/3598 ,  G02B6/366 ,  G02B6/4204 ,  G02B6/4215 ,  G02B6/4234 ,  G02B6/4246 ,  H04B10/503 ,  H04J14/06

Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

Abstract translation: 器件可以包括衬底。 该装置可以包括安装到基板的载体。 该装置可以包括安装在载体上的发射器光子集成电路（PIC）。 发射器PIC可以包括当电压或电流施加到多个激光器之一时产生光信号的多个激光器。 该器件可以包括安装到衬底的第一微机电结构（MEMS）。 第一MEMS可以包括第一组透镜。 该装置可以包括安装到基板的平面光波电路（PLC）。 PLC可以由第一MEMS的第一组透镜光耦合到多个激光器。 该装置可以包括安装到基板的第二MEMS，其可以包括第二组透镜，其可被配置为将PLC光耦合到光纤。