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公开(公告)号:US20170194310A1
公开(公告)日:2017-07-06
申请号:US15398713
申请日:2017-01-04
申请人: Infinera Corporation
发明人: Peter W. Evans , John W. Osenbach , Fred A. Kish, JR. , Jiaming Zhang , Miguel Iglesias Olmedo , Maria Anagnosti
CPC分类号: H01L25/18 , G02B6/00 , G02B6/12004 , G02B6/4274 , G02B2006/12121 , G02B2006/12123 , G02B2006/12135 , G02B2006/12147 , G02F1/2255 , G02F2001/212 , G02F2201/127 , H01L23/49827 , H01L23/49838 , H01L23/5381 , H01L23/5386 , H01L24/09 , H01L24/49 , H01L31/02005 , H01L2924/00014 , H01L2924/1433 , H01L2924/15323 , H04B10/40 , H04B10/506 , H01L2224/45099
摘要: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.
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公开(公告)号:US20170194308A1
公开(公告)日:2017-07-06
申请号:US15398704
申请日:2017-01-04
申请人: Infinera Corporation
发明人: Peter W. Evans , John W. Osenbach , Fred A. Kish, JR. , Jiaming Zhang , Miguel Iglesias Olmedo , Maria Anagnosti
IPC分类号: H01L25/18 , H01L23/00 , G02B6/12 , H01L23/538 , G02F1/225 , H01L23/498 , H01L31/02
CPC分类号: H01L25/18 , G02B6/00 , G02B6/12004 , G02B6/4274 , G02B2006/12121 , G02B2006/12123 , G02B2006/12135 , G02B2006/12147 , G02F1/2255 , G02F2001/212 , G02F2201/127 , H01L23/49827 , H01L23/49838 , H01L23/5381 , H01L23/5386 , H01L24/09 , H01L24/49 , H01L31/02005 , H01L2924/00014 , H01L2924/1433 , H01L2924/15323 , H04B10/40 , H04B10/506 , H01L2224/45099
摘要: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.
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公开(公告)号:US20150318952A1
公开(公告)日:2015-11-05
申请号:US14699907
申请日:2015-04-29
申请人: Infinera Corporation
发明人: Timothy Butrie , Michael Reffle , Xiaofeng Han , Mehrdad Ziari , Vikrant Lal , Peter W. Evans , Fred A. Kish, JR. , Donald J. Pavinski , Jie Tang , David Coult
CPC分类号: H04B10/40 , G02B6/3584 , G02B6/3598 , G02B6/366 , G02B6/4204 , G02B6/4215 , G02B6/4234 , G02B6/4246 , H04B10/503 , H04J14/06
摘要: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.
摘要翻译: 器件可以包括衬底。 该装置可以包括安装到基板的载体。 该装置可以包括安装在载体上的发射器光子集成电路(PIC)。 发射器PIC可以包括当电压或电流施加到多个激光器之一时产生光信号的多个激光器。 该器件可以包括安装到衬底的第一微机电结构(MEMS)。 第一MEMS可以包括第一组透镜。 该装置可以包括安装到基板的平面光波电路(PLC)。 PLC可以由第一MEMS的第一组透镜光耦合到多个激光器。 该装置可以包括安装到基板的第二MEMS,其可以包括第二组透镜,其可被配置为将PLC光耦合到光纤。
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公开(公告)号:US20190342009A1
公开(公告)日:2019-11-07
申请号:US15973266
申请日:2018-05-07
申请人: Infinera Corporation
发明人: Peter W. Evans , Fred A. Kish, JR. , Vikrant Lal , Jacco Ploumeekers , Timothy Butrie , David G. Coult , John W. Osenbach , Jie Tang , Jiaming Zhang
摘要: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel. As a result, yields and minimum performance may improve compared to PICs that do not have a spare channel and manufacturing costs may be reduced. Alternatively, connections, such as fiber connections, may be made only to the operation or best performing channels.
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公开(公告)号:US20180131159A1
公开(公告)日:2018-05-10
申请号:US15866138
申请日:2018-01-09
申请人: Infinera Corporation
发明人: Peter W. Evans , Mingzhi Lu , Fred A. Kish, JR. , Vikrant Lal , Scott Corzine , John W. Osenbach , Jin Yan
CPC分类号: H01S5/1017 , G02B6/12004 , G02B6/2813 , G02B26/04 , G02B2006/12121 , G02F1/2255 , G02F1/2257 , G02F2001/212 , G02F2201/58 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0425 , H01S5/0612 , H01S5/06256 , H01S5/1003 , H01S5/1014 , H01S5/1215 , H01S5/2081 , H01S5/22 , H01S5/3013 , H01S5/3214 , H01S2301/176 , H04B10/2507 , H04B10/40 , H04B10/503 , H04B10/616 , H04B10/67
摘要: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
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公开(公告)号:US20170194764A1
公开(公告)日:2017-07-06
申请号:US15398690
申请日:2017-01-04
申请人: Infinera Corporation
发明人: Peter W. Evans , Mingzhi Lu , Fred A. Kish, JR. , Vikrant Lal , Scott Corzine , John W. Osenbach , Jin Yan
CPC分类号: H01S5/0612 , G02B6/2813 , G02F1/2255 , G02F1/2257 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0425 , H01S5/06256 , H01S5/1003 , H01S5/1014 , H01S5/1017 , H01S5/1215 , H01S5/2081 , H01S5/22 , H01S5/3013 , H01S5/3214 , H01S2301/176 , H04B10/2507 , H04B10/40 , H04B10/503 , H04B10/616 , H04B10/67
摘要: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
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公开(公告)号:US20190089475A1
公开(公告)日:2019-03-21
申请号:US16191974
申请日:2018-11-15
申请人: Infinera Corporation
发明人: Fred A. Kish, JR. , Michael Reffle , Jeffrey T. Rahn , John Osenbach , Timothy Butrie , Xiaofeng Han , Mark Missey , Mehrdad Ziari , Peter W. Evans
IPC分类号: H04J14/02 , H04B10/50 , H04B10/079
摘要: Consistent with the present disclosure, a photonic integrated circuit (PIC) is provided that has 2 N channels (N being an integer). The PIC is optically coupled to N optical fibers, such that each of N polarization multiplexed optical signals are transmitted over a respective one of the N optical fibers. In another example, each of the N optical fibers supply a respective one of N polarization multiplexed optical signals to the PIC for coherent detection and processing. A multiplexer and demultiplexer may be omitted from the PIC, such that the optical signals are not combined on the PIC. As a result, the transmitted and received optical signals incur less loss and amplified spontaneous emission (ASE) noise. In addition, optical taps may be more readily employed on the PIC to measure outputs of the lasers, such as widely tunable lasers (WTLs), without crossing waveguides.
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公开(公告)号:US20180331498A1
公开(公告)日:2018-11-15
申请号:US15866148
申请日:2018-01-09
申请人: Infinera Corporation
发明人: Peter W. Evans , Mingzhi Lu , Fred A. Kish, JR. , Vikrant Lal , Scott Corzine , John W. Osenbach , Jin Yan
IPC分类号: H01S5/06 , H04B10/67 , G02B6/12 , H04B10/50 , H04B10/40 , H04B10/2507 , H04B10/61 , G02B6/28 , G02B26/04 , G02F1/225 , H01S5/024 , H01S5/026 , H01S5/30 , H01S5/22 , H01S5/10 , H01S5/0625 , H01S5/042 , H01S5/12 , H01S5/20 , G02F1/21 , H01S5/32
CPC分类号: H01S5/1017 , G02B6/12004 , G02B6/2813 , G02B26/04 , G02B2006/12121 , G02F1/2255 , G02F1/2257 , G02F2001/212 , G02F2201/58 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0425 , H01S5/0612 , H01S5/06256 , H01S5/1003 , H01S5/1014 , H01S5/1215 , H01S5/2081 , H01S5/22 , H01S5/3013 , H01S5/3214 , H01S2301/176 , H04B10/2507 , H04B10/40 , H04B10/503 , H04B10/616 , H04B10/67
摘要: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
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公开(公告)号:US20180131157A1
公开(公告)日:2018-05-10
申请号:US15866115
申请日:2018-01-09
申请人: Infinera Corporation
发明人: Peter W. Evans , Mingzhi Lu , Fred A. Kish, JR. , Vikrant Lal , Scott Corzine , John W. Osenbach , Jin Yan
CPC分类号: H01S5/1017 , G02B6/12004 , G02B6/2813 , G02B26/04 , G02B2006/12121 , G02F1/2255 , G02F1/2257 , G02F2001/212 , G02F2201/58 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0425 , H01S5/0612 , H01S5/06256 , H01S5/1003 , H01S5/1014 , H01S5/1215 , H01S5/2081 , H01S5/22 , H01S5/3013 , H01S5/3214 , H01S2301/176 , H04B10/2507 , H04B10/40 , H04B10/503 , H04B10/616 , H04B10/67
摘要: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
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公开(公告)号:US20190089476A1
公开(公告)日:2019-03-21
申请号:US16192032
申请日:2018-11-15
申请人: Infinera Corporation
发明人: Fred A. Kish, JR. , Michael Reffle , Jeffrey T. Rahn , John Osenbach , Timothy Butrie , Xiaofeng Han , Mark Missey , Mehrdad Ziari , Peter w. Evans
IPC分类号: H04J14/02 , H04B10/50 , H04B10/079
摘要: Consistent with the present disclosure, a photonic integrated circuit (PIC) is provided that has 2 N channels (N being an integer). The PIC is optically coupled to N optical fibers, such that each of N polarization multiplexed optical signals are transmitted over a respective one of the N optical fibers. In another example, each of the N optical fibers supply a respective one of N polarization multiplexed optical signals to the PIC for coherent detection and processing. A multiplexer and demultiplexer may be omitted from the PIC, such that the optical signals are not combined on the PIC. As a result, the transmitted and received optical signals incur less loss and amplified spontaneous emission (ASE) noise. In addition, optical taps may be more readily employed on the PIC to measure outputs of the lasers, such as widely tunable lasers (WTLs), without crossing waveguides.
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