公开(公告)号：US5989104A

公开(公告)日：1999-11-23

申请号：US5889

申请日：1998-01-12

申请人： Inki Kim ,  Chris Karlsrud ,  John Natalicio ,  James Schlueter ,  Thomas K. Crosby

发明人： Inki Kim ,  Chris Karlsrud ,  John Natalicio ,  James Schlueter ,  Thomas K. Crosby

IPC分类号： B24B37/30 ,  B24B1/00

CPC分类号： B24B37/30

摘要： A carrier for semiconductor wafers to be polished comprises a rigid upper housing, a rigid pressure plate and a gimbal mechanism connecting the plate and housing which permits the plate to gimbal or wobble relative to the housing. The pressure plate is a one-piece component and has a central cut-out portion in which the gimbal mechanism is disposed, thereby establishing a low gimbal point and reducing the incidence of tilting. The gimbal mechanism has an inner bearing ring which is fastened to the underside of the housing, and an outer bearing ring which is fastened to an outer portion of the pressure plate.

摘要翻译： 要抛光的半导体晶片的载体包括刚性上壳体，刚性压板和连接板和壳体的万向节机构，其允许板相对于壳体万向架或摇摆。 压板是一体式部件，具有设置万向架机构的中央切口部，由此形成低的万向节点，并减少倾斜的发生。 万向架机构具有固定在壳体下侧的内部轴承环和紧固在压力板外部的外部轴承环。

公开(公告)号：US5872633A

公开(公告)日：1999-02-16

申请号：US798803

申请日：1997-02-12

申请人： Paul Holzapfel ,  James Schlueter ,  Chris Karlsrud ,  Warren Lin

发明人： Paul Holzapfel ,  James Schlueter ,  Chris Karlsrud ,  Warren Lin

IPC分类号： B24B49/00 ,  G01B11/06 ,  H01L21/66 ,  B24B49/12

CPC分类号： B24B37/013 ,  B24B49/00 ,  G01B11/0625 ,  H01L22/26 ,  H01L22/12

摘要： The present invention provides methods and apparatus which permit the in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a work piece, e.g., a semiconductor wafer. A probe is disposed proximate to the outer perimeter of a polishing pad on a CMP table such that the probe establishes optical contact with the wafer surface as a portion of the wafer extends beyond the outer perimeter of the polishing pad. A nozzle may be provided to apply a stream of compressed air at the disk surface under inspection to thereby remove excess slurry from the local region of the workpiece being inspected. A broad band light source is employed in conjunction with a fiber optic cable to direct light at the wafer surface. A bifurcated probe is employed such that the light applied to the workpiece surface is reflected back to and captured by a corresponding optical sensor connected to a fiber optic cable. The captured reflected light received by the receptor sensor and fiber optic cable assembly is applied to a photospectrum meter which analyzes the reflected light. An output signal from the photospectrum meter is transmitted to a processor which includes a smart algorithm configured to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer.

摘要翻译： 本发明提供了允许在工件中原位实质测量工件例如半导体晶片的表面层的实际厚度的方法和装置。 探针靠近CMP台面上的抛光垫的外周设置，使得当晶片的一部分延伸超过抛光垫的外周边时，探针与晶片表面建立光学接触。 可以设置喷嘴以在被检查的盘表面处施加压缩空气流，从而从被检查的工件的局部区域去除多余的浆料。 宽带光源与光纤电缆结合使用以引导晶片表面的光。 采用分叉探针，使得施加到工件表面的光被反射回并连接到光纤电缆的相应的光学传感器捕获。 由受体传感器和光缆组件接收的所捕获的反射光被施加到分析反射光的光谱仪上。 来自光谱仪的输出信号被传送到处理器，处理器包括配置成计算表面层厚度的智能算法。 或者，半导体层的反射特性可能影响反射信号的性质; 可以检测反射信号的变化，以指示金属层何时从氧化物层去除。

公开(公告)号：US6095900A

公开(公告)日：2000-08-01

申请号：US276983

申请日：1999-03-26

申请人： Clinton O. Fruitman ,  Thomas K. Crosby ,  James Schlueter

发明人： Clinton O. Fruitman ,  Thomas K. Crosby ,  James Schlueter

IPC分类号： B24B41/06 ,  B24D18/00 ,  B24B1/00

CPC分类号： B24B37/30 ,  B24B41/061 ,  B24D18/00

摘要： A carrier for semiconductor wafers to be polished comprises a backing pad vulcanized to a pressure plate. The backing pad is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive film of a thermosetting, thermally reactive material forms an integral bond between the backing pad and pressure plate. The backing pad, adhesive film and pressure plate together comprise a nearly ideally elastic assembly. The exposed face of the backing pad is profiled to a desired profile without effecting crumbling of the rubber material.

摘要翻译： 用于待抛光的半导体晶片的载体包括硫化成压力板的衬垫。 衬垫由诸如氯丁橡胶，SBR或天然橡胶的橡胶材料形成。 热固性热反应性材料的粘合膜在背衬垫和压力板之间形成整体结合。 背衬垫，粘合膜和压力板一起构成几乎理想的弹性组件。 衬垫的露出面被成型为期望的轮廓，而不影响橡胶材料的破碎。

公开(公告)号：US20060102657A1

公开(公告)日：2006-05-18

申请号：US10988864

申请日：2004-11-15

申请人： Paul Naslund ,  James Schlueter

发明人： Paul Naslund ,  James Schlueter

IPC分类号： B67D5/60

CPC分类号： F16K31/52416 ,  Y10T137/87571 ,  Y10T137/87587 ,  Y10T137/87635

摘要： An apparatus for selective eductive dispensing of multiple chemical fluids from separate fluid containers includes a motive fluid inlet; an eductor in fluid communication with said motive fluid inlet; a selector switch defining at least one inlet and an outlet therein, said inlet and outlet in fluid communication with one another and said outlet in fluid communication with said eductor and wherein said selector switch inlet is in selective fluid communication with said fluid containers depending on the position of the selector switch; and a valve located between said motive fluid inlet and said eductor, said valve selectively opened and closed by movement of said selector switch.

摘要翻译： 用于从分离的流体容器中选择性地喷射多种化学流体的装置包括：运动流体入口; 与所述动力流体入口流体连通的喷射器; 选择器开关，其在其中限定至少一个入口和出口，所述入口和出口彼此流体连通，并且所述出口与所述喷射器流体连通，并且其中所述选择器开关入口根据所述流体容器选择性地与所述流体容器连通 选择开关的位置; 以及位于所述运动流体入口和所述喷射器之间的阀，所述阀通过所述选择器开关的移动选择性地打开和关闭。

公开(公告)号：US20050287928A1

公开(公告)日：2005-12-29

申请号：US10880945

申请日：2004-06-29

申请人： Vishwas Hardikar ,  James Schlueter ,  Guangshun Chen

发明人： Vishwas Hardikar ,  James Schlueter ,  Guangshun Chen

IPC分类号： B08B1/00 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10 ,  B08B3/12 ,  B24B49/00 ,  H01L21/00 ,  H01L21/02

CPC分类号： H01L21/67219 ,  B08B1/00 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10 ,  B08B3/12 ,  H01L21/02074 ,  H01L21/67051

摘要： A method and apparatus are provided for post-CMP cleaning of a semiconductor work piece. The method comprises the steps of subjecting the work piece to a first cleaning composition having one of an acidic pH and a basic pH and subjecting the work piece to a second cleaning composition having an acidic pH, if the first cleaning composition has a basic pH and subjecting the work piece to a second cleaning composition having a basic pH, if the first cleaning composition has an acidic pH.

摘要翻译： 提供了一种用于半导体工件的后CMP清洗的方法和装置。 该方法包括以下步骤：如果第一清洁组合物具有碱性pH和第一清洁组合物，则将工件经受具有酸性pH和碱性pH之一的第一清洁组合物，并将工件经受具有酸性pH的第二清洁组合物 如果第一清洁组合物具有酸性pH，则将工件经受具有碱性pH的第二清洁组合物。