公开(公告)号：US6113468A

公开(公告)日：2000-09-05

申请号：US286702

申请日：1999-04-06

申请人： John Natalicio

发明人： John Natalicio

IPC分类号： B24B37/30 ,  B24B37/32 ,  B24B5/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A wafer carrier for polishing or planarizing semiconductor workpieces or wafers includes a pressure plate configured to hold a wafer to be polished or to be planarized against a polishing pad, and is further configured to rotate the wafer during the polishing or planarizing process. A retaining ring for holding the wafer is mounted about the periphery of the pressure plate. The retaining ring slides vertically and independently relative to the pressure plate. A polishing pad load ring is also slideably mounted about the periphery of the retaining ring. The pad load ring is biased against the polishing pad, and slides vertically and independently of the pressure plate and the wafer retaining ring. In operation, the wafer carrier is moved across the polishing pad, which is sufficiently compliant to cause wave deformation of the surface of the pad. The pad load ring provides a buffer area which displaces wave deformation of the polishing pad away from the edge of the wafer, and thus minimizes the beveling of the wafer lower peripheral edge.

摘要翻译： 用于抛光或平坦化半导体工件或晶片的晶片载体包括被配置为保持要抛光的晶片或者相对于抛光垫进行平面化的压板，并且还被配置为在抛光或平坦化处理期间使晶片旋转。 用于保持晶片的保持环围绕压板的周边安装。 保持环相对于压板垂直且独立地滑动。 抛光垫加载环也围绕保持环的周边可滑动地安装。 衬垫负载环偏压在抛光垫上，并且垂直滑动并独立于压板和晶片保持环滑动。 在操作中，晶片载体移动穿过抛光垫，其足够柔顺以引起焊盘表面的波形变形。 衬垫加载环提供缓冲区域，其使抛光垫的波形变形远离晶片的边缘，从而最小化晶片下部周边边缘的斜面。

公开(公告)号：US5916015A

公开(公告)日：1999-06-29

申请号：US900479

申请日：1997-07-25

申请人： John Natalicio

发明人： John Natalicio

IPC分类号： B24B47/22 ,  B24B49/00 ,  B24B7/22

CPC分类号： B24B37/30 ,  B24B37/0053 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00

摘要： A carrier assembly for use in the processing of semiconductor wafers which avoids the use of a gimbal mechanism. The wafer carrier assembly comprises a backing pad for the wafer, with the wafer and backing pad secured within a retaining ring, such that the retaining ring, wafer, and backing pad move as single, integral assembly. A resiliently flexible outer housing terminates in a pad load ring transmits the rotation of the drive shaft to the load plate while allowing limited axial movement between the outer ring and inner ring assembly. The wafer/load plate assembly is permitted to float within the outer ring while the outer ring locally depresses the polishing pad near the wafer periphery, to mitigate edge exclusion.

摘要翻译： 用于处理半导体晶片的载体组件，其避免使用万向架机构。 晶片载体组件包括用于晶片的衬垫，其中晶片和衬垫固定在保持环内，使得保持环，晶片和衬垫作为单个整体组件移动。 弹性柔性的外壳终止于衬垫加载环，将驱动轴的旋转传递到负载板，同时允许外圈和内圈组件之间的有限的轴向运动。 允许晶片/负载板组件在外环内浮动，而外环在晶圆周边部分局部压下抛光垫，以减轻边缘排除。

公开(公告)号：US5989104A

公开(公告)日：1999-11-23

申请号：US5889

申请日：1998-01-12

申请人： Inki Kim ,  Chris Karlsrud ,  John Natalicio ,  James Schlueter ,  Thomas K. Crosby

发明人： Inki Kim ,  Chris Karlsrud ,  John Natalicio ,  James Schlueter ,  Thomas K. Crosby

IPC分类号： B24B37/30 ,  B24B1/00

CPC分类号： B24B37/30

摘要： A carrier for semiconductor wafers to be polished comprises a rigid upper housing, a rigid pressure plate and a gimbal mechanism connecting the plate and housing which permits the plate to gimbal or wobble relative to the housing. The pressure plate is a one-piece component and has a central cut-out portion in which the gimbal mechanism is disposed, thereby establishing a low gimbal point and reducing the incidence of tilting. The gimbal mechanism has an inner bearing ring which is fastened to the underside of the housing, and an outer bearing ring which is fastened to an outer portion of the pressure plate.

摘要翻译： 要抛光的半导体晶片的载体包括刚性上壳体，刚性压板和连接板和壳体的万向节机构，其允许板相对于壳体万向架或摇摆。 压板是一体式部件，具有设置万向架机构的中央切口部，由此形成低的万向节点，并减少倾斜的发生。 万向架机构具有固定在壳体下侧的内部轴承环和紧固在压力板外部的外部轴承环。

公开(公告)号：US5958148A

公开(公告)日：1999-09-28

申请号：US895284

申请日：1997-07-16

申请人： Paul Holzapfel ,  Andrew Yednak, III ,  John Natalicio ,  Chad Goudie

发明人： Paul Holzapfel ,  Andrew Yednak, III ,  John Natalicio ,  Chad Goudie

IPC分类号： G01B11/00 ,  B08B3/02 ,  B24B37/013 ,  B24B49/00 ,  B24B49/12 ,  G01B11/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/66

CPC分类号： G01B11/0625 ,  B24B37/013 ,  B24B49/00 ,  H01L22/26 ,  H01L22/12

摘要： The present invention provides methods and apparatus which permit the in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a workpiece, e.g., a semiconductor wafer. A probe is disposed proximate the outer perimeter of a polishing pad on a CMP table such that the probe establishes optical contact with the wafer surface as a portion of the wafer extends beyond the outer perimeter of the polishing pad. A reflected signal received by the probe is analyzed to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer. In accordance with another aspect of the present invention, a nozzle assembly having a plurality of fluid outlets may be provided to apply a stream of deionized water at the surface under inspection to thereby remove excess slurry and debris from the local region of the workpiece being inspected. A second fluid nozzle may be provided to apply a stream of deionized water to the tip of the probe tip to thereby clean the probe tip between endpoint detection cycles. The nozzle assembly may also include a third fluid nozzle for applying a stream of nitrogen gas to thereby deflect debris away from the probe tip during the endpoint detection procedure and a fourth fluid nozzle for applying a stream of nitrogen gas to thereby remove water and debris from the probe tip during the endpoint detection procedure.

摘要翻译： 本发明提供了允许在工作中原位，基本上实时地测量工件（例如半导体晶片）的表面层的实际厚度的方法和装置。 探针设置在CMP台上的抛光垫的外周附近，使得当晶片的一部分延伸超过抛光垫的外周时，该探针与晶片表面建立光学接触。 分析由探针接收的反射信号以计算表面层的厚度。 或者，半导体层的反射特性可能影响反射信号的性质; 可以检测反射信号的变化，以指示金属层何时从氧化物层去除。 根据本发明的另一方面，可以提供具有多个流体出口的喷嘴组件以在被检查的表面上施加去离子水流，从而从被检查的工件的局部区域移除多余的浆料和碎屑 。 可以提供第二流体喷嘴以将去离子水流施加到探针尖端的尖端，从而在终点检测周期之间清洁探针尖端。 喷嘴组件还可以包括用于施加氮气流的第三流体喷嘴，从而在终点检测过程期间将碎屑偏离探针末端，以及用于施加氮气流的第四流体喷嘴，从而从水中除去水和碎屑 在端点检测过程中的探针尖端。

公开(公告)号：US5899216A

公开(公告)日：1999-05-04

申请号：US855208

申请日：1997-05-13

申请人： Chad Goudie ,  John Natalicio ,  Greg Olsen ,  Eric Shurtliff

发明人： Chad Goudie ,  John Natalicio ,  Greg Olsen ,  Eric Shurtliff

IPC分类号： H01L21/00 ,  B08B3/02

CPC分类号： H01L21/67028 ,  Y10S134/902

摘要： The present invention relates to a wafer cleaning machine having an input station, a water track, a cleaning station, a rinsing station, a spin-dry station, and a load station. The input station includes two or more wafer supply areas for a continuous supply of wafers to the water track. After the wafers enter the water track from the input station, the wafers are transported down the track into the wafer cleaning station. The wafer cleaning station comprises a plurality of pairs of rollers which pull the wafers through the cleaning station and thereby clean the top and bottom flat surfaces of the wafers. A one-piece cleaning fluid manifold formed within the upper panel of the cleaning station facilitates effective distribution of the cleaning fluid to the rollers. From the cleaning station, the wafers are transported to a rinse station. From the rinsing station, the workpieces are transferred to a dual spin-dry station. A manipulator assembly is configured to cooperate with the rinse station to lift and transport the rinsed wafers from the rinse station to the two spin-dry assemblies. At the spin-dry station, the workpieces are spun at a high speed to remove any residual water droplets or the like. The spin-dry assemblies include a water/debris shield that rises during the spin-dry process. From the dual spin-dry station, a robotic transfer arm removes the work pieces from the spin-dry station and places them in one of a pair of unload cassettes. After the cassettes are filled with wafers, they are removed and transferred for subsequent processing.

摘要翻译： 本发明涉及具有输入站，水道，清洁站，漂洗站，旋转干燥站和装载站的晶片清洗机。 输入站包括用于连续向水轨供应晶片的两个或更多个晶片供应区域。 在晶片从输入站进入水道之后，将晶片从轨道传送到晶片清洁站。 晶片清洁站包括多对辊，其将晶片拉过清洁站，从而清洁晶片的顶部和底部平坦表面。 形成在清洁站的上面板内的一体式清洁流体歧管有助于将清洁流体有效地分配到辊。 从清洁站，将晶片运送到冲洗站。 从冲洗站将工件转移到双旋转干燥站。 操纵器组件配置成与冲洗台配合以将漂洗的晶片从冲洗台提升并输送到两个旋转干燥组件。 在旋转干燥站，工件以高速旋转以除去残留的水滴等。 旋转干燥组件包括在旋转干燥过程中上升的水/碎片防护罩。 从双旋转干燥站，机器人传输臂从旋转干燥站移除工件并将它们放置在一对卸载盒中的一个中。 在盒被充满晶片之后，它们被移除并转移用于随后的处理。

公开(公告)号：US06354927B1

公开(公告)日：2002-03-12

申请号：US09577760

申请日：2000-05-23

申请人： John Natalicio

发明人： John Natalicio

IPC分类号： B24B500

CPC分类号： B24B37/30 ,  B24B37/32

摘要： An easily adjustable wafer retaining ring for both coarse and micro-adjustable engagement with a carrier head assembly of a chemical-mechanical polishing apparatus is disclosed. The carrier head supports the wafer on a wafer support surface during the polishing process. The wafer is held in place by a wafer retaining ring which has an inner and an outer set of threads around the inner and outer circumferences of the retaining ring. The carrier head has engagement means for engaging the retaining ring using the inner and outer threads of the retaining ring. The lower surface of the retaining ring has a groove, preferably, v-shaped which is in contact with the carrier head and parallel to the plane of rotational engagement of the retaining ring with the carrier head. A locking ring is receivably engageable with the groove of the retaining ring. A lock limits further vertical displacement of the retaining ring by bearing pressure down on the locking ring. The carrier head is attached to a fixed ring by retaining ring bolts. The bolts provide for a coarse adjustment of the vertical displacement of the retaining ring by threadably engaging the retaining ring with the carrier head to a predetermined depth relative to the wafer support surface. The bolts provide for a fine adjustment of the vertical displacement of the retaining ring, by using the lock to provide pressure to engage the locking ring with the retaining ring in order to limit further vertical displacement of said retaining ring.

摘要翻译： 公开了一种易于调节的晶片保持环，用于与化学机械抛光装置的载体头组件进行粗调和微调可接合。 载体头在抛光过程中将晶片支撑在晶片支撑表面上。 晶片通过晶片保持环保持就位，该晶片保持环具有围绕保持环的内周和外周的内部和外部一组螺纹。 承载头具有接合装置，用于使用保持环的内螺纹和外螺纹接合保持环。 保持环的下表面具有凹槽，优选为V形，其与承载头接触并且平行于保持环与承载头的旋转接合平面。 锁定环可接收地与保持环的凹槽接合。 锁定通过在锁定环上承受压力来限制保持环的进一步垂直位移。 承载头通过固定环螺栓连接到固定环。 螺栓通过将保持环与承载头螺纹地接合到相对于晶片支撑表面的预定深度来提供保持环的垂直位移的粗调。 螺栓通过使用锁来提供压力以使锁定环与保持环接合以便限制所述保持环的进一步的垂直位移来提供保持环的垂直位移的微调。

公开(公告)号：US06283836B1

公开(公告)日：2001-09-04

申请号：US09264067

申请日：1999-03-08

申请人： Clinton Fruitman ,  Mark Meloni ,  John Natalicio

发明人： Clinton Fruitman ,  Mark Meloni ,  John Natalicio

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  B24B49/10 ,  B26D1/0006 ,  B26D1/16 ,  B26D3/28 ,  B26D7/2621 ,  B26D2001/002 ,  B26D2001/0033 ,  B26D2001/0046 ,  B26D2001/0053 ,  Y10T83/7788

摘要： A method and apparatus for resurfacing a polishing pad using non-abrasive techniques. These techniques include shaving, milling, or planing the upper working surface of the polishing pad using an edged cutting tool to alter the microtexture and micro-topology of the surface to produce a desired surface contour or planarity. This precise conditioning of the microscopic features of the polishing pad surface controls dishing in workpieces during polishing.

摘要翻译： 一种使用非研磨技术对抛光垫进行表面重塑的方法和装置。 这些技术包括使用边缘切削工具来剃削，铣削或抛光抛光垫的上部工作表面，以改变表面的微观结构和微观拓扑以产生所需的表面轮廓或平面性。 抛光垫表面的微观特征的精确调节控制了抛光过程中工件的凹陷。

公开(公告)号：US06217410B1

公开(公告)日：2001-04-17

申请号：US09345047

申请日：1999-06-30

申请人： Paul Holzapfel ,  Andrew Yednak, III ,  John Natalicio ,  Chad Goudie

发明人： Paul Holzapfel ,  Andrew Yednak, III ,  John Natalicio ,  Chad Goudie

IPC分类号： B24B5100

CPC分类号： G01B11/0625 ,  B24B37/013 ,  B24B49/00 ,  H01L22/12 ,  H01L22/26

摘要： The present invention provides methods and apparatus which permit the in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a workpiece, e.g., a semiconductor wafer. A probe is disposed proximate the outer perimeter of a polishing pad on a CMP table such that the probe establishes optical contact with the wafer surface as a portion of the wafer extends beyond the outer perimeter of the polishing pad. A reflected signal received by the probe is analyzed to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer. In accordance with another aspect of the present invention, a nozzle assembly having a plurality of fluid outlets may be provided to apply a stream of deionized water at the surface under inspection to thereby remove excess slurry and debris from the local region of the workpiece being inspected. A second fluid nozzle may be provided to apply a stream of deionized water to the tip of the probe tip to thereby clean the probe tip between endpoint detection cycles. The nozzle assembly may also include a third fluid nozzle for applying a stream of nitrogen gas to thereby deflect debris away from the probe tip during the endpoint detection procedure and a fourth fluid nozzle for applying a stream of nitrogen gas to thereby remove water and debris from the probe tip during the endpoint detection procedure.

摘要翻译： 本发明提供了允许在工作中原位，基本上实时地测量工件（例如半导体晶片）的表面层的实际厚度的方法和装置。 探针设置在CMP台上的抛光垫的外周附近，使得当晶片的一部分延伸超过抛光垫的外周时，该探针与晶片表面建立光学接触。 分析由探针接收的反射信号以计算表面层的厚度。 或者，半导体层的反射特性可能影响反射信号的性质; 可以检测反射信号的变化，以指示金属层何时从氧化物层去除。 根据本发明的另一方面，可以提供具有多个流体出口的喷嘴组件以在被检查的表面上施加去离子水流，从而从被检查的工件的局部区域移除多余的浆料和碎屑 。 可以提供第二流体喷嘴以将去离子水流施加到探针尖端的尖端，从而在终点检测周期之间清洁探针尖端。 喷嘴组件还可以包括用于施加氮气流的第三流体喷嘴，从而在终点检测过程期间将碎屑偏离探针末端，以及用于施加氮气流的第四流体喷嘴，从而从水中除去水和碎屑 在端点检测过程中的探针尖端。

公开(公告)号：US06213855B1

公开(公告)日：2001-04-10

申请号：US09360536

申请日：1999-07-26

申请人： John Natalicio

发明人： John Natalicio

IPC分类号： B24B4106

CPC分类号： B24B37/107 ,  B24B37/30 ,  B24B47/12

摘要： A wafer carrier for polishing or planarizing semiconductor workpieces or wafers includes a pressure plate, an upper housing, and a lower housing. The pressure plate is configured to hold a wafer to be polished or planarized against a polishing pad, and further configured to rotate about the lower housing of the wafer carrier to rotate the wafer during the polishing or planarizing process. The wafer carrier includes an electric direct drive motor, with the stators of the motor disposed in the lower housing and the rotors of the motor disposed in the pressure plate, to rotate the pressure plate about the lower housing. Accordingly, when electric power is supplied to the stators of the direct drive motor, in response to the magnetic flux generated by the stators, the rotors of the motor rotate the pressure plate. The wafer carrier also includes a compliant material disposed between the upper housing and the lower housing of the wafer carrier to form a flexible joint which maintains the wafer in substantially parallel and in substantially full contact with the polishing pad. Additionally, the lower housing of the wafer carrier is pressurized to cause pressure to be applied across substantially all of the surface area of the pressure plate and substantially uniformly across the surface area of the wafer.

摘要翻译： 用于抛光或平坦化半导体工件或晶片的晶片载体包括压板，上壳体和下壳体。 压板被配置为将待抛光或平面化的晶片保持在抛光垫上，并进一步配置成在晶片载体的下壳体周围旋转，以在抛光或平坦化处理期间旋转晶片。 晶片载体包括电动直接驱动电动机，其中电动机的定子设置在下壳体中，电机的转子设置在压板中，以使压板围绕下壳体旋转。 因此，当向直接驱动电动机的定子提供电力时，响应于由定子产生的磁通量，电动机的转子旋转压板。 晶片载体还包括设置在晶片载体的上壳体和下壳体之间的柔性材料，以形成柔性接头，该柔性接头保持晶片与抛光垫基本平行且基本上完全接触。 此外，晶片载体的下壳体被加压，以便在压板的基本上所有的表面区域上施加压力并且基本均匀地跨过晶片的表面区域施加压力。