公开(公告)号：US20240395991A1

公开(公告)日：2024-11-28

申请号：US18644145

申请日：2024-04-24

Applicant: Innolux Corporation

Inventor： Kuang-Pin Chao ,  Min-Han Tsai ,  Hao-Jung Huang

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16

Abstract: The disclosure provides an electronic device and a tiled electronic device. The electronic device includes a hybrid substrate. The hybrid substrate includes a first circuit substrate, multiple second circuit substrates, an interlayer, and multiple electrical connection units. The first circuit substrate has a first surface and a second surface. The multiple second circuit substrates are disposed on the first surface. The interlayer is disposed between the multiple second circuit substrates and the first circuit substrate. The multiple electrical connection units penetrate the multiple second circuit substrates respectively. At least one electrical connection unit among the plurality of electrical connection units includes a through hole and a conductive material disposed in the through hole. At least one electrical connection unit is electrically connected to the first circuit substrate. The electronic device and the tiled electronic device according to the disclosure can improve process yield or save costs.

公开(公告)号：US08969904B2

公开(公告)日：2015-03-03

申请号：US14252417

申请日：2014-04-14

Applicant: Innolux Corporation

Inventor： Kuang-Pin Chao ,  Hao-Jung Huang ,  Min-Han Tsai

IPC: H01L21/00 ,  H01L51/52 ,  H01L27/32

CPC classification number: H01L51/0024 ,  H01L27/322 ,  H01L27/3272 ,  H01L2251/558

Abstract: An organic light emitting display device includes a first substrate, an organic light emitting diode array, a thin film encapsulation layer, a second substrate, a sealant member and a buffer layer. First substrate has a light emitting region and a non-light emitting region. OLED array is configured in light emitting region covered by encapsulation layer. Second substrate has a color filter array and is arranged opposite first substrate. Sealant member is disposed between first and second substrates. Buffer layer has a first light shielding layer disposed thereon, is arranged between first and second substrates, and is configured in light emitting region. Light shielding layer is arranged between buffer layer and encapsulation layer. The sum of the buffer layer's thickness and a gap distance from buffer layer to encapsulation layer has a range from 5 to 20 μm. Buffer layer has hardness smaller than that of the color filter array.

Abstract translation: 有机发光显示装置包括第一基板，有机发光二极管阵列，薄膜封装层，第二基板，密封剂部件和缓冲层。 第一衬底具有发光区域和非发光区域。 OLED阵列配置在由封装层覆盖的发光区域中。 第二基板具有滤色器阵列并且与第一基板相对地布置。 密封剂构件设置在第一和第二基板之间。 缓冲层具有设置在其上的第一遮光层，布置在第一和第二基板之间，并且被配置在发光区域中。 遮光层设置在缓冲层和封装层之间。 缓冲层的厚度和从缓冲层到封装层的间隙距离的总和为5〜20μm。 缓冲层的硬度小于滤色器阵列的硬度。

公开(公告)号：US20240250076A1

公开(公告)日：2024-07-25

申请号：US18402766

申请日：2024-01-03

Applicant: Innolux Corporation

Inventor： Kuang-Pin Chao ,  Min-Han Tsai ,  Hao-Jung Huang

IPC: H01L25/16

CPC classification number: H01L25/162 ,  H01L25/167

Abstract: An electronic device includes a first curved module and a second curved module. The first curved module includes a first electronic element and a first curved unit. The second curved module is spliced to one side of the first curved module and includes a second electronic element and a second curved unit. The first curved unit and the second curved unit include curved surfaces.

公开(公告)号：US20230238366A1

公开(公告)日：2023-07-27

申请号：US18086685

申请日：2022-12-22

Applicant: Innolux Corporation

Inventor： Kuang-Pin Chao ,  Min-Han Tsai ,  Hao-Jung Huang

IPC: H01L25/13 ,  H01L25/075

CPC classification number: H01L25/13 ,  H01L25/0753 ,  G09F9/3026

Abstract: A splicing device includes a first splicing unit and a second splicing unit. The first splicing unit includes a first substrate, a first light-emitting unit, and a second light-emitting unit. The second splicing unit includes a second substrate, a third light-emitting unit, and a fourth light-emitting unit. P is a pitch between the first light-emitting unit and the second light-emitting unit, and a pitch between the third light-emitting unit and the fourth light-emitting unit. LA1 is a horizontal distance from a center of the second light-emitting unit to a first reference plane. LB3 is a horizontal distance from a boundary between a light-emitting surface of the second splicing unit and a second reference plane to the first reference plane. LB1x and LB1y are respectively a horizontal component and a vertical component of a distance from the boundary to a center of the third light-emitting unit. LA2 is a vertical distance from the light-emitting surface of the first splicing unit to a bottom surface of the first substrate. LB2 is a vertical distance from the bottom surface of the first substrate to the boundary. The splicing device satisfies:









(


LA
⁢
1

+

LB
⁢
3

+

LB
⁢
1
⁢
x


)

2

+


(


LA
⁢
2

+

LB
⁢
2

+

LB
⁢
1
⁢
y


)

2



P

≤

1.5
.

公开(公告)号：US11469360B2

公开(公告)日：2022-10-11

申请号：US16862914

申请日：2020-04-30

Applicant: InnoLux Corporation

Inventor： Chia-Hsien Lin ,  Yung-Kan Chen ,  Chien-Tzu Chu ,  Min-Han Tsai ,  Hao-Jung Huang

IPC: H01L33/64

Abstract: An electronic device is provided. The electronic device includes: a support structure, a heat-dissipation layer, a first adhesive and an electronic panel. The heat-dissipation layer is disposed on the support structure and includes at least one first hole. The first adhesive is disposed in the at least one first hole. The electronic panel is disposed on the heat-dissipation layer.